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Product Detailed Parameters
- Description：10131319-224110PLF-MTK 4.2 22P D
- Series：Minitek® Pwr 4.2 High Current
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.165" (4.20mm)
- Number of Positions：22
- Number of Rows：2
- Row Spacing - Mating：0.165" (4.20mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.138" (3.50mm)
- Overall Contact Length：-
- Insulation Height：0.504" (12.80mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Polyamide (PA66), Nylon 6/6
- Features：Board Lock
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10131319-224110PLF is a Power to the Board connector belonging to the MinitekPwr 4.2 series. It features a 22-position configuration with a 4.2 mm pitch and operates as a double-row header. The component supports a current rating of 12.5 A and utilizes copper contacts with gold mating finish and tin post finish. Designed for vertical surface-mount installation, it functions within an operating temperature range of -40°C to +105°C.
Feature Summary
- Vertical double-row power header design for direct board integration
- Gold-plated contact surfaces ensure reliable electrical conductivity
- High current capacity suitable for power distribution applications
Applications
- Power delivery systems in industrial equipment
- Server and storage backplane connections
- Telecommunications infrastructure hardware
Procurement Notes
Verify the specific suffix PLF against official manufacturer documentation to confirm the exact contact finish specifications, particularly distinguishing between gold and tin plating variations. Ensure compatibility with existing PCB footprint requirements and verify that the vertical mounting angle aligns with mechanical assembly constraints before finalizing procurement orders.
Selection Notes
Select this component when a high-current vertical interconnect is required for power distribution. The 4.2 mm pitch accommodates substantial conductors, while the double-row layout maximizes pin density. Confirm that the operating temperature range meets environmental demands and that the surface-mount technology matches the manufacturing process capabilities.
Part Context
This connector is part of the MinitekPwr 4.2 family, engineered for robust power-to-board applications. The series emphasizes high current handling and reliable performance in demanding environments. As a specialized power connector, it differs from signal-only arrays by supporting significant amperage loads through its wider contact spacing and reinforced structural design.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify cross-reference options directly with the manufacturer or authorized distributors to identify compatible alternatives with matching electrical and mechanical specifications.
