10131935-309ULF

10131935-309ULF

  • Description:CONN RCPT 9POS 0.079 GOLD SMD
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube

SKU:655443649a97 Category: Brand:

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Product Detailed Parameters

  • Description:CONN RCPT 9POS 0.079 GOLD SMD
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube
  • Connector Type:Receptacle
  • Contact Type:Female Socket
  • Style:Board to Board
  • Number of Positions:9
  • Number of Positions Loaded:All
  • Pitch - Mating:0.079" (2.00mm)
  • Number of Rows:1
  • Row Spacing - Mating:-
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:8.00µin (0.203µm)
  • Insulation Color:Black
  • Insulation Height:0.177" (4.50mm)
  • Contact Length - Post:-
  • Operating Temperature:-55°C ~ 125°C
  • Material Flammability Rating:UL94 V-0
  • Contact Finish - Post:Tin
  • Mated Stacking Heights:-
  • Ingress Protection:-
  • Features:-
  • Current Rating (Amps):2A
  • Voltage Rating:200V

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10131935-309ULF

Overview

The Amphenol ICC (FCI) 10131935-309ULF is a surface-mount receptacle connector from the Minitek series. It features 9 positions with a 0.079-inch (2.00mm) pitch and gold GXT™ contact plating. Designed for board-to-board stacking applications, it utilizes a through-hole termination method. The component operates within a temperature range of -55°C to 85°C and carries an MSL rating of 1.

Feature Summary

  • Zero-insertion-force design for reliable mating
  • Gold-plated contacts for enhanced conductivity
  • Board stacking capability via through-hole termination

Applications

  • High-density electronic assemblies
  • Industrial control systems
  • Telecommunications equipment

Procurement Notes

Verify RoHS compliance status and confirm current availability as distribution channels may vary. Ensure the specific suffix matches project requirements for plating and packaging. Cross-reference datasheet specifications against PCB footprint dimensions prior to final procurement decisions.

Selection Notes

Select this component for applications requiring robust board-to-board interconnects with high cycle durability. The 2.00mm pitch accommodates standard density layouts while the gold finish ensures long-term signal integrity in demanding environments.

Part Context

This part belongs to the Minitek family of connectors, known for their reliability in harsh industrial conditions. The 10131935 series specifically targets high-performance computing and storage solutions where stable electrical connections are critical for system uptime.

Replacement Considerations

Consult official substitution lists for compatible variants such as the 10131935-925ULF if tin plating is acceptable. Verify mechanical compatibility before swapping between different plating options or package styles.

10131935-309ULF10131935-309ULF

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