10131935-318ULF

10131935-318ULF

  • Description:CONN RCPT 18POS 0.079 GOLD SMD
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube

SKU:bbbbad288b76 Category: Brand:

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Product Detailed Parameters

  • Description:CONN RCPT 18POS 0.079 GOLD SMD
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube
  • Connector Type:Receptacle
  • Contact Type:Female Socket
  • Style:Board to Board
  • Number of Positions:18
  • Number of Positions Loaded:All
  • Pitch - Mating:0.079" (2.00mm)
  • Number of Rows:1
  • Row Spacing - Mating:-
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:8.00µin (0.203µm)
  • Insulation Color:Black
  • Insulation Height:0.177" (4.50mm)
  • Contact Length - Post:-
  • Operating Temperature:-55°C ~ 125°C
  • Material Flammability Rating:UL94 V-0
  • Contact Finish - Post:Tin
  • Mated Stacking Heights:-
  • Ingress Protection:-
  • Features:-
  • Current Rating (Amps):2A
  • Voltage Rating:200V

Download product information

10131935-318ULF

Overview

The Amphenol ICC (FCI) 10131935-318ULF is a board-to-board connector from the Micropax series. It features a 2 mm pitch and a single row of contacts. The component utilizes gold contact finish for reliable signal transmission. Rated for 2A current and 200V voltage, it supports surface mount installation with right-angle orientation. Operating temperature ranges from -55°C to +125°C.

Feature Summary

  • Push-pull fastening mechanism for secure mating
  • Gold contact finish ensures durability
  • Polyamide insulation material provides stability

Applications

  • Board-to-board interconnection systems
  • High-density electronic assemblies
  • Industrial control equipment

Procurement Notes

Verify RoHS compliance status through official manufacturer documentation before integration. Confirm that the specific suffix indicates standard configuration without functional changes. Ensure storage conditions meet moisture sensitivity level requirements during handling.

Selection Notes

Select this component for applications requiring high-density vertical connections. The push-pull feature simplifies assembly processes compared to screw-lock variants. Verify spatial constraints accommodate the right-angle profile and mounting height specifications.

Part Context

This part belongs to the Micropax family of connectors designed for compact electronic designs. The series offers various pin counts and configurations to support diverse board-to-board interface needs within modern electronics manufacturing.

Replacement Considerations

Consult official cross-reference lists for verified substitutes. Generic equivalents may lack compatible mechanical locking features or precise dimensional tolerances required for proper fit.

FAQ

What is the contact finish specification?

The contacts feature a gold finish to ensure reliable conductivity and corrosion resistance.

Does this connector use a push-pull mechanism?

Yes, the design incorporates a push-pull fastening type for secure engagement.

10131935-318ULF10131935-318ULF

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