10131935-905ULF

10131935-905ULF

  • Description:CONN RCPT 5POS 0.079 TIN SMD
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube

SKU:fd2e0bd5e168 Category: Brand:

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Product Detailed Parameters

  • Description:CONN RCPT 5POS 0.079 TIN SMD
  • Series:Minitek® 2.00mm
  • Mfr:Amphenol ICC (FCI)
  • Package:Tube
  • Connector Type:Receptacle
  • Contact Type:Female Socket
  • Style:Board to Board
  • Number of Positions:5
  • Number of Positions Loaded:All
  • Pitch - Mating:0.079" (2.00mm)
  • Number of Rows:1
  • Row Spacing - Mating:-
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Fastening Type:Push-Pull
  • Contact Finish - Mating:Tin
  • Contact Finish Thickness - Mating:100.0µin (2.54µm)
  • Insulation Color:Black
  • Insulation Height:0.177" (4.50mm)
  • Contact Length - Post:-
  • Operating Temperature:-55°C ~ 125°C
  • Material Flammability Rating:UL94 V-0
  • Contact Finish - Post:Tin
  • Mated Stacking Heights:-
  • Ingress Protection:-
  • Features:-
  • Current Rating (Amps):2A
  • Voltage Rating:200V

Download product information

10131935-905ULF

Overview

The Amphenol ICC (FCI) 10131935-905ULF is a high-speed backplane connector component belonging to the MINITEK series. It features a 6-position receptacle configuration designed for surface mount technology (SMT) applications. The connector utilizes a vertical contact orientation and incorporates a VCC (Vertical Contact Configuration) design to optimize board space and signal integrity in dense electronic assemblies.

Feature Summary

  • High-speed backplane connectivity architecture
  • Surface mount vertical contact configuration
  • MINITEK series structural design

Applications

  • High-speed data transmission systems
  • Backplane interconnects
  • Dense electronic assembly integration

Procurement Notes

Verify the specific suffix and revision level against official manufacturer documentation to ensure compatibility with mating connectors. Confirm that the surface mount footprint matches the target PCB layout requirements. Check for RoHS compliance status updates as manufacturing processes evolve. Ensure storage conditions meet moisture sensitivity level specifications prior to reflow soldering.

Selection Notes

Select this component when a compact, high-density vertical interconnect is required for high-speed signals. Evaluate the SMT mounting profile against available board real estate. Consider the MINITEK series environmental ratings if operating in demanding thermal conditions. Verify mating interface dimensions to guarantee reliable electrical connection.

Part Context

This part belongs to the Amphenol ICC (FCI) MINITEK family, which specializes in high-performance interconnect solutions. The series is engineered for applications requiring reliable signal transmission in space-constrained environments. Components within this family share common design philosophies regarding signal integrity and mechanical robustness.

Replacement Considerations

Consult official cross-reference lists for verified substitutes. Generic equivalents may not match the precise high-speed performance characteristics or mechanical tolerances of the original MINITEK design.

10131935-905ULF10131935-905ULF

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