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Product Detailed Parameters
- Description：CONN RCPT 8POS 0.079 TIN SMD
- Series：Minitek® 2.00mm
- Mfr：Amphenol ICC (FCI)
- Package：Tube
- Connector Type：Receptacle
- Contact Type：Female Socket
- Style：Board to Board
- Number of Positions：8
- Number of Positions Loaded：All
- Pitch - Mating：0.079" (2.00mm)
- Number of Rows：1
- Row Spacing - Mating：-
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：100.0µin (2.54µm)
- Insulation Color：Black
- Insulation Height：0.177" (4.50mm)
- Contact Length - Post：-
- Operating Temperature：-55°C ~ 125°C
- Material Flammability Rating：UL94 V-0
- Contact Finish - Post：Tin
- Mated Stacking Heights：-
- Ingress Protection：-
- Features：-
- Current Rating (Amps)：2A
- Voltage Rating：200V
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Overview
The Amphenol ICC (FCI) 10131935-908ULF is a Micropax™ series board-to-board connector designed for high-density interconnect applications. It features a 200-position configuration with a 0.64mm pitch, utilizing a dual-row arrangement to maximize circuit board space efficiency. The component is specified as a plug type with central contacts and employs a right-angle through-hole mounting style for secure PCB attachment. Contact surfaces are finished with GXT™ gold plating to ensure reliable signal transmission and corrosion resistance in demanding environments.
Feature Summary
- High-density 200-position layout optimized for compact electronic assemblies
- GXT™ gold contact finish providing durable electrical performance
- Right-angle through-hole termination ensuring stable mechanical fixation
Applications
- Data communication equipment backplanes
- Telecommunications infrastructure systems
- Server and storage device internal interconnects
Procurement Notes
Verify the specific ordering suffix against official Amphenol documentation to confirm exact pin count, orientation, and plating specifications. Ensure compatibility with mating receptacles within the same Micropax family. Confirm RoHS compliance status and moisture sensitivity levels prior to integration into production workflows.
Selection Notes
Select this component when high I/O density is required within constrained vertical or horizontal spaces. The right-angle design facilitates efficient cable routing and board stacking. Evaluate thermal management requirements and mating cycle durability against application standards before finalizing the design.
Part Context
This connector belongs to the Micropax™ family, a line of high-performance interconnect solutions developed by Amphenol ICC (formerly FCI). The series is engineered for robust connectivity in datacom and telecom sectors, offering various configurations to support evolving bandwidth and density demands in modern electronic systems.
Replacement Considerations
Consult official cross-reference guides for verified substitutes. Generic equivalents may not match the precise 0.64mm pitch or GXT™ plating characteristics required for system integrity.
