10131935-911ULF

Overview

The Amphenol ICC (FCI) 10131935-911ULF is a high-density board-to-board connector system designed for reliable signal transmission in compact electronic assemblies. This specific component features a 91-position configuration with a 0.5mm pitch, utilizing a dual-row header and socket arrangement to maximize connection density within limited PCB space. The connector supports surface mount technology, ensuring secure attachment to the printed circuit board during manufacturing processes. It is engineered to meet stringent mechanical and electrical standards for modern consumer electronics and industrial applications requiring robust interconnectivity.

Feature Summary

• High-density 0.5mm pitch design for compact space-constrained applications
• Dual-row header and socket configuration for increased I/O capacity
• Surface mount termination style for automated assembly compatibility
• UL recognized component certification for safety compliance

Applications

• Mobile device internal interconnects
• Consumer electronics motherboard connections
• Industrial control panel signal routing
• Medical equipment sensor interfaces

Procurement Notes

Verify the exact part number suffix against the manufacturer's latest datasheet to ensure correct contact plating and mating partner compatibility. Confirm that the required mating header or socket is sourced from the same product family to guarantee proper mechanical fit and electrical performance. Check for any recent RoHS or REACH compliance updates relevant to your region's regulatory requirements before finalizing procurement orders.

Selection Notes

Select this connector when high pin count is required within a minimal footprint area on the PCB layout. Ensure the mating component matches the 0.5mm pitch and dual-row architecture to maintain signal integrity. Consider the operating temperature range and current carrying capacity requirements of the specific application to verify that the standard specifications meet the system's thermal and electrical loads without derating issues.

Part Context

This component belongs to Amphenol ICC's high-density board-to-board connector portfolio, which focuses on miniaturization and reliability for next-generation electronics. The series is characterized by its precise engineering and consistent performance across various environmental conditions. It serves as a critical interconnect solution where space optimization and signal stability are paramount, distinguishing it from lower-density alternatives in the broader connector market.

Replacement Considerations

Direct replacements must match the 91-position count, 0.5mm pitch, and dual-row surface mount format. Verify that alternative suppliers offer components with identical housing dimensions and terminal spacing to ensure seamless integration into existing PCB designs without retooling or layout modifications.