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Product Detailed Parameters
- Description：INTERCONNECT RECTANGULAR
- Series：Minitek® Pwr 3.0 High Current
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：12
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole, Right Angle
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.343" (8.71mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Polyamide (PA), Nylon, Halogen Free
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：12A
- Voltage Rating：250VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10132449-1241GTLF is a Minitek Power 3.0 HCC DR VTH HDR connector designed for power-to-board applications. It features a dual row configuration with 12 positions and a 3.00mm pitch. The header utilizes through-hole, right-angle termination with gold plating on the mating contacts. Constructed from LCP insulation, it supports operating temperatures ranging from -40°C to 105°C and meets UL94 V-0 flammability standards.
Feature Summary
- Dual row high current contact design for robust power distribution
- Right-angle through-hole mounting for compact board integration
- Gold-plated contacts ensuring reliable signal and power transmission
Applications
- Power supply modules requiring high current density
- Industrial control systems with space-constrained layouts
- Telecommunications infrastructure equipment
Procurement Notes
Verify the specific suffix 'GTLF' against official datasheets to confirm the exact pin count, pitch, and plating thickness. Ensure compatibility with mating receptacle housings within the Minitek Power 3.0 series. Confirm RoHS compliance status and check for any recent product change notices affecting material composition or packaging specifications before finalizing procurement orders.
Selection Notes
Select this component when a dual-row, right-angle power header is required for board-level interconnects. The 3.00mm pitch accommodates higher current loads compared to standard signal headers. Evaluate mechanical constraints regarding the right-angle profile and ensure sufficient clearance for the through-hole soldering process during assembly.
Part Context
This component belongs to the Minitek Power 3.0 series by Amphenol ICC (FCI), engineered for high-current wire-to-board connections. The series offers various configurations to support diverse power delivery needs in modern electronic assemblies, balancing electrical performance with mechanical reliability.
Replacement Considerations
Direct substitutes must match the 12-position count, 3.00mm pitch, and dual-row right-angle form factor. Verify that alternative headers maintain identical current ratings and thermal characteristics to ensure system integrity without redesign.
