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Product Detailed Parameters
- Description：CONN HEADER VERT 20POS 3MM
- Series：Minitek® Pwr 3.0 High Current
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：20
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.390" (9.91mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：-
- Contact Material：Copper Alloy
- Insulation Material：Polyamide (PA9T), Nylon 9T
- Features：Board Guide, Glow Wire Compliant
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：250V
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Overview
The Amphenol ICC (FCI) 10132450-2011GLF is a vertical power-to-board header from the MinitekPwr 3.0 series. It features an 8-position, 2-row configuration with a 3 mm pitch and straight through-hole solder termination. The connector utilizes tin-plated copper alloy contacts housed in black polyamide insulation, rated for 12 A current and 600 VAC voltage. Designed for high-power applications, it operates within a temperature range of -40°C to +105°C and meets UL94 V-0 flammability standards.
Feature Summary
- High-current capability supporting up to 12 A per contact
- Robust 600 VAC voltage rating for demanding power distribution
- Durable tin-plated copper alloy contacts ensuring reliable conductivity
- Black polyamide housing providing thermal stability and UL94 V-0 compliance
Applications
- Server and storage system power distribution
- Telecommunications equipment power modules
- Industrial control board interconnects
- High-density power supply units
Procurement Notes
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm pin count, plating type, and packaging format. Ensure the selected variant matches the required mechanical height and termination style for the target PCB layout. Cross-reference the component number with the latest revision history to avoid obsolete or superseded part numbers during procurement.
Selection Notes
Select this component when a vertical, high-current power connection is required on a printed circuit board. The 3 mm pitch allows for wider spacing between contacts compared to signal headers, reducing arcing risks. Verify that the PCB pad design accommodates the through-hole solder pins and that the assembly process supports the specified operating temperature range without degrading the polyamide insulation.
Part Context
This connector belongs to the MinitekPwr 3.0 family, designed specifically for power delivery in compact electronic systems. The series offers various configurations to support different current loads and board space constraints. As an FCI product, it integrates into broader connectivity ecosystems used in data center and industrial infrastructure applications requiring reliable power transmission.
Replacement Considerations
Consult the official Amphenol FCI cross-reference documentation for verified substitute part numbers. Do not assume compatibility based solely on pitch or position count; verify electrical ratings and mechanical dimensions before substitution.
