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Product Detailed Parameters
- Description：CONN PWR3.0 RA HEADER
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：8
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：8
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole, Right Angle
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.126" (3.20mm)
- Overall Contact Length：-
- Insulation Height：0.172" (4.37mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Gold
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：Board Guide
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：5A per Contact
- Voltage Rating：-
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Overview
The Amphenol ICC (FCI) part number 10136654-0822LF is a Minitek Power 3.0 series header connector designed for power-to-board applications. It features an 8-position configuration with a 3.0 mm pitch, utilizing single-row vertical through-hole mounting. The contacts are constructed from copper alloy and finished with gold flash plating to ensure reliable conductivity. The housing is made of black Liquid Crystal Polymer (LCP), providing high thermal stability and mechanical strength. This component supports current ratings up to 8.5 A and withstands voltages of 600 VAC, operating within a temperature range of -40°C to +105°C.
Feature Summary
- Gold flash plated copper contacts for enhanced corrosion resistance and signal integrity
- Liquid Crystal Polymer (LCP) housing material for superior thermal performance
- Integrated CPA and TPA mechanisms to secure mating and terminal positioning
Applications
- Industrial control systems requiring robust power distribution
- Telecommunications infrastructure equipment
- Server and storage device internal power connections
Procurement Notes
Verify the specific contact plating thickness and housing color against the official datasheet before integration. Confirm that the required crimp terminals or pins are sourced separately, as they are not included with the connector housing. Ensure compatibility with the target PCB layout regarding hole spacing and row alignment.
Selection Notes
Select this component when a high-current, low-profile solution is needed for vertical board mounting. The 3.0 mm pitch allows for substantial current carrying capacity compared to finer pitches. Verify that the LCP material properties meet the environmental requirements of the specific application zone.
Part Context
This connector belongs to the Minitek Power 3.0 family, which focuses on delivering high reliability in compact form factors. The series is engineered for demanding environments where vibration resistance and thermal endurance are critical. It complements other FCI interconnect solutions by offering standardized dimensions for easy system integration.
Replacement Considerations
No direct public substitute part numbers are confirmed in the provided documentation. Cross-reference with other Minitek Power 3.0 variants only if pin count and pitch match exactly.
