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Product Detailed Parameters
- Description：CONN PWR3.0 RA HEADER
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：2
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Board or Cable
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.172" (4.37mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：Flash
- Contact Finish - Post：Gold
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：Solder Retention
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600V
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Overview
The Amphenol ICC (FCI) 10136655-0221LF is a Minitek Power 3.0 series power-to-board header connector designed for surface mount technology applications. It features a right-angle configuration with two positions and a 3 mm pitch. The contacts are male pins made of copper with gold plating, rated for 8.5 A current and 600 VAC voltage. The housing is constructed from black liquid crystal polymer (LCP), providing an operating temperature range from -40°C to +105°C and an insulation resistance of 1 GOhm.
Feature Summary
- Right-angle surface mount design for compact board integration
- Gold-plated copper contacts ensure reliable electrical conductivity
- High-temperature LCP housing supports robust thermal performance
Applications
- Power distribution in industrial equipment
- Server and storage system power delivery
- Telecommunications infrastructure power boards
Procurement Notes
Verify the specific ordering suffix against official Amphenol documentation to confirm contact plating thickness and housing material variants. Confirm availability status as supply conditions may vary by region. Ensure compatibility with automated SMT placement processes before finalizing procurement orders.
Selection Notes
Select this component when a low-profile, high-current power connection is required in space-constrained designs. The 3 mm pitch allows for higher current capacity compared to smaller signal connectors. Verify that the right-angle orientation aligns with the mechanical layout requirements of the target printed circuit board assembly.
Part Context
This part belongs to the Minitek Power 3.0 family, which provides standardized power interconnect solutions. The series is engineered for high reliability in demanding environments, offering consistent performance across various power-to-board configurations within the Amphenol FCI portfolio.
Replacement Considerations
Consult official substitution lists for direct replacements. Generic equivalents may not match the specific 3 mm pitch or gold plating requirements necessary for maintaining the original circuit's current rating and corrosion resistance.
