10136655-0722LF

10136655-0722LF

  • Description:CONN PWR3.0 RA HEADER
  • Series:Minitek® Pwr 3.0
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray

SKU:1d46fc137f1a Category: Brand:

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Product Detailed Parameters

  • Description:CONN PWR3.0 RA HEADER
  • Series:Minitek® Pwr 3.0
  • Mfr:Amphenol ICC (FCI)
  • Package:Tray
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.118" (3.00mm)
  • Number of Positions:7
  • Number of Rows:1
  • Row Spacing - Mating:-
  • Number of Positions Loaded:All
  • Style:Board to Board or Cable
  • Shrouding:Shrouded - 4 Wall
  • Mounting Type:Surface Mount, Right Angle
  • Termination:Solder
  • Fastening Type:Locking Ramp
  • Contact Length - Mating:-
  • Contact Length - Post:-
  • Overall Contact Length:-
  • Insulation Height:0.172" (4.37mm)
  • Contact Shape:Square
  • Contact Finish - Mating:Gold
  • Contact Finish Thickness - Mating:Flash
  • Contact Finish - Post:Gold
  • Contact Material:Copper Alloy
  • Insulation Material:Liquid Crystal Polymer (LCP)
  • Features:Solder Retention
  • Operating Temperature:-40°C ~ 105°C
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Black
  • Current Rating (Amps):Varies by Wire Gauge
  • Voltage Rating:600V

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10136655-0722LF

Overview

The Amphenol ICC (FCI) part number 10136655-0722LF is a Minitek Power 3.0 series power-to-board connector header. It features a 2-position configuration with a 3.0 mm pitch and utilizes gold-plated contacts for reliable conductivity. Designed for surface mount termination, this right-angle component ensures secure board integration. The housing is constructed from black Liquid Crystal Polymer (LCP), providing thermal stability and mechanical strength. Rated for 8.5 A current and 600 VAC voltage, it operates within a temperature range of -40°C to +105°C. This single-row male pin header is engineered for high-density power distribution in compact electronic assemblies.

Feature Summary

  • High current capacity rated at 8.5 A for robust power delivery
  • Liquid Crystal Polymer (LCP) housing for superior thermal resistance
  • Gold flash plating on copper alloy contacts to ensure low contact resistance
  • Right-angle surface mount design for efficient space utilization

Applications

  • Power distribution modules in industrial equipment
  • Internal power connections in consumer electronics
  • Battery management systems in portable devices
  • High-density server and storage backplanes

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact contact plating thickness and packaging type. Ensure compatibility with mating socket specifications regarding current ratings and voltage withstand capabilities. Confirm that the selected variant meets the required operating temperature range for the intended application environment before finalizing procurement orders.

Selection Notes

Select this component when a high-current, right-angle power connection is required in a limited vertical space. The 3.0 mm pitch allows for significant current handling compared to finer pitches. Consider the LCP material properties for applications involving reflow soldering at elevated temperatures. Verify that the 600 VAC rating aligns with the system's electrical isolation requirements and safety standards.

Part Context

This connector belongs to the Minitek Power 3.0 family, which is designed for demanding power applications requiring high reliability. The series offers various configurations including vertical and right-angle headers in different row counts. Amphenol FCI designs these components to meet stringent industrial and commercial standards for durability and electrical performance in power-intensive environments.

Replacement Considerations

Direct substitutes must match the 3.0 mm pitch, 2-position count, right-angle orientation, and SMT termination style. Verify that any alternative component maintains the same 8.5 A current rating and 600 VAC voltage rating. Ensure the replacement uses compatible housing materials like LCP for similar thermal performance and dimensional fit within the existing PCB footprint.

10136655-0722LF10136655-0722LF

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