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Product Detailed Parameters
- Description：CONN PWR3.0 RA HEADER
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：6
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.125" (3.18mm)
- Overall Contact Length：-
- Insulation Height：0.390" (9.91mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：15.0µin (0.38µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：Board Guide, Glow Wire Compliant
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：-
- Voltage Rating：600V
Download product information
Overview
The Amphenol ICC (FCI) 10136656-0631LF is a Minitek Power 3.0 series power-to-board header designed for surface mount technology applications. This component features a right-angle configuration with a 3mm pitch and accommodates six positions in a single row. It utilizes male pin contacts made of copper with gold plating to ensure reliable conductivity. The housing is constructed from black liquid crystal polymer (LCP), providing high thermal stability and mechanical durability. Rated for 8.5A current and 600VAC voltage, it operates within a temperature range of -40°C to +105°C.
Feature Summary
- Right-angle surface mount design for efficient board space utilization
- Gold-plated copper contacts for enhanced corrosion resistance
- High-temperature LCP housing for robust environmental performance
Applications
- Power distribution in industrial control systems
- Server and storage equipment power interfaces
- Telecommunications infrastructure power connections
Procurement Notes
Verify the specific suffix codes against official Amphenol documentation to confirm plating thickness and material composition. Ensure that the ordering information matches the exact pin count and orientation required for the target PCB layout. Cross-reference the datasheet for any recent product change notices or lifecycle status updates before finalizing procurement plans.
Selection Notes
Select this connector when a high-current power interface is required in a compact, right-angle form factor. The 3mm pitch allows for substantial current carrying capacity while maintaining a low profile. Consider the operating temperature range and voltage ratings to ensure compatibility with the system's electrical requirements and environmental conditions.
Part Context
This component belongs to the Minitek Power 3.0 family, which specializes in high-power board-to-board and power-to-board interconnects. The series is engineered for applications demanding reliable power transmission in dense electronic assemblies. It represents Amphenol FCI's focus on durable, high-performance solutions for modern electronics manufacturing.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with existing footprints and mating connectors before considering alternative sources.
