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Product Detailed Parameters
- Description：10136656-1141NLF-MTK 3.0 11P SR
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：11
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：0.125" (3.18mm)
- Overall Contact Length：-
- Insulation Height：0.390" (9.91mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：Board Guide, Glow Wire Compliant
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The 10136656-1141NLF is a Minitek Power 3.0 series header connector manufactured by Amphenol ICC (FCI). It features an 11-position configuration with a 3.00mm pitch, designed for vertical through-hole mounting. The contacts are gold-plated to ensure reliable signal integrity and low contact resistance. This component supports board-to-wire applications, offering a robust solution for power and signal transmission in compact electronic assemblies.
Feature Summary
- Vertical through-hole design for secure PCB integration
- Gold-plated contacts for enhanced conductivity
- Minitek Power 3.0 series reliability
Applications
- Board-to-wire interconnects
- Power distribution modules
- Signal transmission in compact electronics
Procurement Notes
Verify the specific ordering suffix 'NLF' against the manufacturer's current datasheet to confirm plating thickness and material specifications. Ensure compatibility with mating wire harnesses or cable assemblies. Cross-reference the part number with official Amphenol ICC documentation to avoid confusion with similar Minitek variants.
Selection Notes
Select this component when a 3.00mm pitch vertical header is required for through-hole assembly. Consider the 11-position count and gold plating requirements for your application. Verify that the housing material and current ratings meet the thermal and electrical demands of the target circuit design.
Part Context
This part belongs to the Minitek Power 3.0 family, known for high-density interconnects. Amphenol ICC (FCI) acquired FCI, integrating these connectors into their broader portfolio. The series is widely used in industrial and commercial electronics requiring reliable power and signal connections.
Replacement Considerations
Check for direct substitutes within the Minitek Power 3.0 series with identical pin counts and pitch. Verify mechanical dimensions and contact plating options before substituting.
