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The Amphenol ICC (FCI) part number 10137925-1812LF is a Minitek Pwr 3.0 series connector header designed for surface mount technology. It features a right-angle configuration with 18 positions arranged in a dual-row layout. The mating pitch is 0.118 inches (3.00 mm), and the row spacing matches this dimension. The housing is constructed from black liquid crystal polymer (LCP) rated UL94 V-0, providing an insulation height of 0.390 inches (9.90 mm). Male pins are made of copper alloy with tin plating on both the mating and shank surfaces. The unit supports a maximum voltage of 600V and operates within a temperature range of -40°C to +105°C.
Verify that the specific ordering suffix corresponds to the required contact plating and packaging format. Confirm that the surface mount footprint aligns with the target PCB design guidelines. Ensure compatibility with mating cables or harnesses specified for the 3.00mm pitch series. Check for any recent product change notices affecting material composition or dimensions.
Select this component when a right-angle, dual-row header is required for high-current applications. The 3.00mm pitch allows for substantial conductor sizes compared to smaller pitches. The tin-plated contacts offer cost-effective conductivity suitable for general power environments. Consider the four-wall shield if signal integrity or noise reduction is necessary alongside power delivery.
This connector belongs to the Minitek Pwr 3.0 family, engineered for robust power transmission. The series utilizes LCP insulation for high thermal stability and flame resistance. The design integrates a locking rail system to prevent accidental disconnection. It serves as a reliable interface between rigid circuit boards and flexible wiring systems in demanding electronic assemblies.
Direct substitutes within the same series include 10137925-1832LF, which shares the same physical dimensions and electrical ratings but utilizes gold plating instead of tin. Verify that the alternative plating meets the specific corrosion and wear requirements of the application environment.