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Product Detailed Parameters
- Description：MTK3.0 DR 06P VT SMT HDR
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tray
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：6
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.390" (9.91mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：-
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Board Lock, Glow Wire Compliant, Pick and Place
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10137927-0611LF is a Minitek Power 3.0 series header connector designed for surface mount technology. It features a dual-row configuration with six positions and a 3.00mm pitch. The component utilizes tin-plated contacts and is housed in black liquid crystal polymer (LCP). Rated for 600VAC, it supports a maximum operating temperature of 105°C and a minimum of -40°C. The connector employs a right-angle vertical through-hole solder termination style.
Feature Summary
- Supports high-current power delivery applications via the Minitek Power 3.0 architecture
- Features a robust right-angle vertical mounting design for efficient board space utilization
- Utilizes tin-plated contacts to ensure reliable electrical connectivity
Applications
- Power distribution modules in industrial equipment
- Server and storage system power boards
- Consumer electronics internal power connections
Procurement Notes
Verify the specific suffix requirements against the manufacturer's latest datasheet to ensure compatibility with intended assembly processes. Confirm that the tin plating specification meets the environmental and durability requirements of the target application environment before finalizing procurement orders.
Selection Notes
Select this component when a low-profile, high-current header is required for surface-mounted power circuits. The 3.00mm pitch allows for significant current carrying capacity compared to smaller signal headers. Ensure the PCB layout accommodates the right-angle vertical form factor and the specified thermal range during the design phase.
Part Context
This connector belongs to the Minitek Power 3.0 family, which is engineered for demanding power-to-board applications. The series is characterized by its ability to handle higher currents while maintaining a compact footprint. It serves as a critical interconnect solution in modern electronic systems requiring reliable power transmission.
Replacement Considerations
Direct substitutes within the same Minitek Power 3.0 series should be evaluated based on matching pin count, pitch, and termination style. Cross-referencing mechanical drawings is essential to verify board compatibility.
