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Product Detailed Parameters
- Description：10137927-1842LF-MTK 3.0 18P DR V
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：18
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Locking Ramp
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.390" (9.91mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Board Lock
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：8.5A
- Voltage Rating：600V
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Overview
The Amphenol ICC (FCI) part number 10137927-1842LF is a Minitek Pwr 3.0 series power connector header designed for surface mount technology. It features an eighteen-position configuration with a 3.00mm pitch, arranged in a dual-row vertical orientation. The contacts are gold-plated to ensure reliable conductivity and corrosion resistance. This component supports high-current applications within the Power to the Board architecture.
Feature Summary
- Dual-row vertical surface mount design for compact board integration
- Gold-plated contacts for enhanced signal integrity and durability
- Backward mateable with traditional 3mm power connectors when signal pins are absent
Applications
- Power distribution on main system boards
- High-density server and storage backplanes
- Industrial control systems requiring robust power connections
Procurement Notes
Verify the specific suffix against official Amphenol documentation to confirm plating thickness and material composition. Ensure compatibility with mating receptacles regarding pin absence for backward mateability. Confirm RoHS compliance status through current manufacturer certificates before finalizing procurement orders.
Selection Notes
Select this component for applications requiring high current capacity in a small footprint. The dual-row vertical format optimizes space efficiency. Verify that the target PCB layout accommodates the 3.00mm pitch and dual-row spacing. Consider thermal management requirements associated with high-power transmission in dense environments.
Part Context
This connector belongs to the Minitek Pwr 3.0 family, engineered for hybrid power and signal transmission. It bridges legacy 3mm standards with modern high-density requirements. The series emphasizes reliability and mechanical stability for demanding electronic infrastructure.
Replacement Considerations
Direct substitutes require matching the 18-position count, 3.00mm pitch, and dual-row SMT vertical form factor. Cross-reference Amphenol internal cross-reference lists for equivalent revisions or updated packaging variants.
