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10138327-10103TLF is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is PCI EXPRESS TH 164P. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 10138327-10103TLF is a PCI Express card edge connector designed for high-speed data transmission. It features 164 positions with a 100mm pitch, supporting PCI Express Gen 3 standards. The component utilizes a vertical through-hole mounting style and solder termination for secure board attachment. Constructed with copper alloy contacts plated in gold, it ensures reliable electrical performance. The connector is rated for a PCB thickness of 1.56 mm and complies with UL safety standards.
Verify the specific ordering suffix to ensure compatibility with required plating thickness and material specifications. Confirm that the selected variant matches the intended PCB stack-up and thermal requirements. Cross-reference the manufacturer's latest documentation to validate compliance with current environmental directives and RoHS standards before finalizing procurement orders.
Select this connector when a vertical orientation is required for PCI Express Gen 3 applications. Ensure the host PCB accommodates the specified 1.56 mm thickness constraint. Evaluate the 164-position count against interface requirements to confirm adequate pin availability for the target circuit design without unnecessary size or cost implications.
This component belongs to the Amphenol ICC (FCI) PCI Express connector family, which provides standardized solutions for server and storage architectures. The brand, now part of Amphenol Commercial, specializes in high-reliability interconnects for demanding electronic environments. This specific model represents a traditional through-hole solution within their broader portfolio of card edge technologies.
Consult official substitution guides for compatible alternatives such as the 10138327-10113TLF variant. Verify mechanical footprint and pinout compatibility before replacing existing inventory. Ensure any substitute maintains identical Gen 3 signaling capabilities and mounting characteristics.
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