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Product Detailed Parameters
- Description：MINITEK UN-SHROUDED-HEADER STRAI
- Series：Minitek® 2.00mm
- Mfr：Amphenol ICC (FCI)
- Package：Bulk,Bag
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.079" (2.00mm)
- Number of Positions：25
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Unshrouded
- Mounting Type：Through Hole
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：0.126" (3.20mm)
- Contact Length - Post：0.130" (3.30mm)
- Overall Contact Length：0.315" (8.00mm)
- Insulation Height：0.059" (1.50mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold, GXT™
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：-
- Operating Temperature：-55°C ~ 125°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：2A (AC/DC)
- Voltage Rating：200VAC/DC
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Overview
The Amphenol ICC (FCI) part number 10138654-G03-25LF is a Minitek series pin header connector designed for board-to-board applications. It features a 2.00 mm pitch with 25 contacts arranged in a single row. The component utilizes a through-hole straight termination method and operates within a temperature range of -55°C to +125°C. Constructed with phosphor bronze contacts, it ensures reliable signal transmission. The housing is made from thermoplastic material rated UL94 V-0 for flammability.
Feature Summary
- Supports pin-in-paste manufacturing processes for automated assembly efficiency
- Provides secure board-to-board interconnection via through-hole mounting
- Features high-density single-row configuration for space-constrained designs
Applications
- High-density electronic module interconnections
- Automated surface-mount assembly workflows
- Industrial control board connections
Procurement Notes
Verify the complete part number including all suffixes against official manufacturer documentation to ensure correct contact plating and housing color specifications. Confirm that the intended application environment falls within the specified operating temperature range. Ensure PCB footprint dimensions align precisely with the 2.00 mm pitch requirements to guarantee proper mechanical fit and electrical continuity during assembly.
Selection Notes
Select this component when a low-profile, high-density solution is required for board-to-board connections. The 2.00 mm pitch offers a balance between signal density and spacing reliability. Consider the through-hole mounting style for robust mechanical stability compared to surface-mount alternatives. Verify compatibility with mating connectors regarding height and contact alignment tolerances.
Part Context
This connector belongs to the Minitek series by Amphenol ICC (FCI), which specializes in compact interconnect solutions. The series is engineered for modern electronics requiring efficient assembly processes. The specific model represents a standard 25-position variant suitable for general signal routing in dense circuit layouts.
Replacement Considerations
Direct substitutes must maintain the 2.00 mm pitch, 25-position count, and through-hole straight termination. Verify identical housing material properties and contact plating specifications to ensure functional equivalence.
