10138978-14111LF

Description：CONN PWR4.2 BMI
Series：Minitek® Pwr 4.2
Mfr：Amphenol ICC (FCI)
Package：Tray

SKU:767725a3d76c Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN PWR4.2 BMI
Series：Minitek® Pwr 4.2
Mfr：Amphenol ICC (FCI)
Package：Tray
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.165" (4.20mm)
Number of Positions：14
Number of Rows：2
Row Spacing - Mating：0.165" (4.20mm)
Number of Positions Loaded：All
Style：Board to Cable/Wire
Shrouding：Shrouded - 4 Wall
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：-
Contact Length - Post：0.138" (3.50mm)
Overall Contact Length：-
Insulation Height：0.555" (14.10mm)
Contact Shape：Square
Contact Finish - Mating：Tin
Contact Finish Thickness - Mating：-
Contact Finish - Post：-
Contact Material：Brass
Insulation Material：Polyamide (PA66), Nylon 6/6
Features：Board Lock, Keying Slot
Operating Temperature：-40°C ~ 105°C
Ingress Protection：-
Material Flammability Rating：UL94 V-2
Insulation Color：Natural
Current Rating (Amps)：Varies by Wire Gauge
Voltage Rating：600VAC/DC

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10138978-14111LF

Overview

The Amphenol ICC (FCI) part number 10138978-14111LF is a Power 4.2 Blind Mate Interface (BMI) connector component. It features a row spacing of 0.165 inches (4.20mm). The housing is constructed from Polyamide (PA66), also known as Nylon 6/6, providing structural integrity for board-to-board applications. This specific item is categorized under the BMI product line designed for high-density interconnects.

Feature Summary

Blind mate interface design for rapid and accurate alignment during assembly
Utilizes Polyamide (PA66) insulation material for thermal stability
Supports 4.20mm row spacing for high-density power distribution

Applications

High-density server backplanes
Data communication equipment interconnects
Industrial control system power distribution

Procurement Notes

Verify the exact mating counterpart within the Power 4.2 BMI series to ensure mechanical compatibility. Confirm that the Polyamide (PA66) housing meets the required thermal ratings for your specific operational environment. Cross-reference the official Amphenol ICC datasheet for precise pinout configurations and recommended crimping or termination tools to guarantee reliable electrical performance.

Selection Notes

Select this component when a 4.20mm pitch blind mate solution is required for robust power delivery. Ensure the application supports the specific mechanical locking mechanisms inherent to the BMI architecture. Evaluate the thermal management capabilities of the PA66 housing against peak operating temperatures. Verify that the target system layout accommodates the physical footprint defined by the 0.165-inch row spacing constraints.

Part Context

This component belongs to the Power 4.2 BMI family, engineered for demanding environments requiring high current capacity and signal integrity. The BMI technology facilitates automated assembly through self-aligning features. Amphenol ICC utilizes this series to provide scalable interconnect solutions for next-generation computing infrastructure, emphasizing reliability and reduced insertion force compared to traditional connectors.