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Product Detailed Parameters
- Description：10138980-0841STLF-MTK 3.0 8P VT
- Series：Minitek® Pwr 3.0
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.118" (3.00mm)
- Number of Positions：8
- Number of Rows：2
- Row Spacing - Mating：0.118" (3.00mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Kinked Pin, Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：0.130" (3.30mm)
- Overall Contact Length：-
- Insulation Height：0.457" (11.60mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Gold
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP)
- Features：-
- Operating Temperature：-40°C ~ 105°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：Varies by Wire Gauge
- Voltage Rating：600VAC/DC
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Overview
The 10138980-0841STLF is a Minitek Power 3.0 header connector manufactured by Amphenol ICC (FCI). It features an 8-position male pin configuration with a 3.00mm pitch. The component utilizes a dual-row, vertical through-hole mounting style for board-to-wire connections. Contact surfaces are finished with 30 microinches of gold plating to ensure reliable signal and power transmission. The housing is designed for high current applications within the mid-power category.
Feature Summary
- Dual-row vertical header design for compact board integration
- Gold-plated contacts for enhanced conductivity and corrosion resistance
- Through-hole termination method for secure mechanical stability
Applications
- Mid-power board-to-wire interconnects
- Power distribution in electronic assemblies
- Signal routing in industrial equipment
Procurement Notes
Verify the specific suffix 'STLF' against official Amphenol documentation to confirm lead-free status and RoHS compliance. Ensure the ordering part number matches the required contact plating thickness and housing material specifications. Cross-reference the datasheet for precise mating force and retention requirements before finalizing procurement.
Selection Notes
Select this component when a dual-row, 8-position header with a 3.00mm pitch is required for vertical mounting. Consider the 30-microinch gold plating for durability in moderate environmental conditions. Evaluate the through-hole footprint compatibility with the target PCB layout and ensure the current rating aligns with the system's power delivery needs.
Part Context
This part belongs to the Minitek Power 3.0 series, which provides solutions for mid-power applications. The series is characterized by its 3.00mm pitch and robust construction suitable for various commercial and industrial electronics. Amphenol ICC (FCI) designs these connectors to support efficient power management and signal integrity in dense circuit board environments.
Replacement Considerations
Consult official Amphenol ICC (FCI) substitution guides for verified alternative part numbers. Generic rectangular headers may not match the specific dual-row geometry or contact plating requirements. Verify that any substitute maintains the same 3.00mm pitch and vertical orientation to ensure proper fit and function.
