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10139371-1020BLF is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is EHPCE RAR 10MP20S. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 10139371-1020BLF is a standard card edge connector receptacle belonging to the EHPCE RAR series. It features a straight mounting style designed for through-hole termination. The component provides 10 positions with a pitch of 5.08 mm. Contact plating is specified as gold to ensure reliable signal transmission. This connector is engineered for high-density applications requiring robust mechanical stability and consistent electrical performance in board-to-board interfaces.
Verify the specific suffix BLF against official Amphenol documentation to confirm material composition and compliance status. Ensure that the 5.08 mm pitch aligns precisely with the mating card edge specifications. Cross-reference the EHPCE RAR series datasheet for accurate housing dimensions and termination parameters before finalizing procurement orders.
Select this component when a straight, through-hole card edge receptacle with a 5.08 mm pitch is required. The gold contact plating makes it suitable for environments where oxidation resistance is critical. Confirm that the 10-position count matches the circuit design needs and that the EHPCE RAR form factor fits within the available enclosure space constraints.
This part belongs to the Amphenol FCI portfolio, now integrated into Amphenol ICC. The EHPCE RAR series represents a line of standard card edge connectors known for reliability in demanding electronic applications. As an Amphenol product, it benefits from extensive engineering resources and global manufacturing standards established after the acquisition of FCI by Amphenol.
Direct substitutes must match the 5.08 mm pitch, 10-position count, and straight through-hole configuration. Verify compatibility with the EHPCE RAR series mechanical interface. Alternative parts should offer equivalent gold contact plating and similar thermal ratings to maintain system performance without redesigning the PCB footprint.
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