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Product Detailed Parameters
- Description：HORIZONTAL HEADER
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：9
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.350" (8.89mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：118.1µin (3.00µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The Amphenol ICC (FCI) part number 10142344-109KLF is a MicroSpace header assembly designed for wire-to-board applications. It features a shrouded design with two rows and nine positions, utilizing a 1.27 mm pitch. The connector employs male pin contacts with gold plating on copper alloy substrates to ensure reliable signal transmission. It supports surface mount termination in a right-angle configuration, facilitating efficient PCB layout. The housing is constructed from black thermoplastic material rated UL 94 V-0 for flammability. Electrical specifications include a current rating of 4 A and a voltage rating of 48 V, operating within a temperature range of -40°C to +130°C.
Feature Summary
- Shrouded dual-row architecture provides secure mating alignment and prevents misinsertion during assembly.
- Gold-plated male pins offer enhanced conductivity and corrosion resistance for stable electrical connections.
- Right-angle surface mount termination enables compact vertical integration onto printed circuit boards.
Applications
- Wire-to-board interconnections in consumer electronics
- Signal routing in industrial control systems
- Data transmission interfaces in telecommunications equipment
Procurement Notes
Verify the complete part number including the KLF suffix against official Amphenol documentation to confirm lead-free compliance and specific packaging requirements. Confirm that the right-angle SMT orientation matches the target PCB footprint design. Ensure environmental ratings meet operational thermal constraints before finalizing procurement orders.
Selection Notes
Select this component when a low-profile, high-density connection is required for wire-to-board applications. The 1.27 mm pitch allows for compact board designs while maintaining adequate spacing. The shrouded design is preferred where mechanical stability and correct pin alignment are critical during mating cycles.
Part Context
This component belongs to the Minitek MicroSpace series by Amphenol ICC (formerly FCI). The series specializes in high-reliability connectors for dense electronic assemblies. The product line emphasizes robust performance in demanding environments through precise engineering and durable materials.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source data. Consult official manufacturer cross-reference guides for compatible alternatives if this specific part number is unavailable.
