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Product Detailed Parameters
- Description：HORIZONTAL HEADER
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：13
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.350" (8.89mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：118.1µin (3.00µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The Amphenol ICC (FCI) part number 10142344-113KLF is a MicroSpace header assembly belonging to the Minitek product family. It is designed as a shrouded, two-row connector with a 1.27 mm pitch and 8 positions. The component utilizes surface mount termination for right-angle installation on printed circuit boards. Electrical ratings include a current capacity of 4 A and a voltage rating of 48 V. The contacts are gold-plated copper alloy pins housed in black thermoplastic. The unit operates within a temperature range of -40°C to +130°C and meets UL 94 V-0 flammability standards.
Feature Summary
- Shrouded design provides protection against misalignment during mating
- Surface mount termination facilitates automated PCB assembly processes
- Gold-plated contacts ensure reliable signal transmission and corrosion resistance
Applications
- Data communication equipment interconnections
- Industrial control system board-to-board connections
- Consumer electronics internal wiring assemblies
Procurement Notes
Verify the specific suffix codes against official manufacturer documentation to confirm pin count, plating thickness, and reel packaging specifications. Ensure that the selected variant matches the required operating temperature range and current load for the target application environment before finalizing procurement orders.
Selection Notes
Select this component when a low-profile, high-density connection is required for signal integrity in compact electronic designs. Consider the right-angle form factor for space-constrained layouts where vertical clearance is limited. Validate that the 1.27 mm pitch aligns with the available footprint on the target printed circuit board layout.
Part Context
This connector belongs to the Minitek MicroSpace series, which focuses on miniaturized interconnect solutions for high-density applications. The series is characterized by its small footprint and robust mechanical retention, making it suitable for modern electronics where space optimization is critical without compromising electrical performance or durability.
Replacement Considerations
Consult official cross-reference lists for direct substitutes. Verify compatibility regarding pitch, row configuration, and mounting style before considering alternative part numbers from other manufacturers.
