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Product Detailed Parameters
- Description：CONN MICROSPACE HDR-ASSY STG T
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：8
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.350" (8.89mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：118.1µin (3.00µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The 10142344-208KLF is a Minitek MicroSpace header assembly manufactured by Amphenol ICC (FCI). It features an 8-position, 2-row configuration with a 1.27 mm pitch and 2.43 mm row spacing. Designed for surface mount installation at a right angle, it utilizes tin-plated copper alloy contacts rated for 4 A current and 48 V voltage. The black thermoplastic housing meets UL 94 V-0 flammability standards and operates within a temperature range of -40°C to +130°C.
Feature Summary
- Right-angle surface mount design for compact PCB integration
- Shrouded housing structure ensures proper connector alignment
- Tin-plated copper alloy contacts provide reliable conductivity
Applications
- Wire-to-board interconnections in consumer electronics
- Signal transmission in industrial control systems
- Data processing equipment internal connections
Procurement Notes
Verify the specific ordering suffix KLF against official Amphenol documentation to confirm plating and packaging specifications. Ensure compatibility with automated SMT placement processes due to reel packaging. Confirm that the right-angle orientation matches the target board layout requirements before procurement.
Selection Notes
Select this component when a low-profile, right-angle header is required for space-constrained applications. The 1.27 mm pitch allows for dense circuit layouts. Verify that the 4 A current rating and 48 V voltage limit align with the system's electrical requirements and thermal management capabilities.
Part Context
This part belongs to the Minitek MicroSpace series, designed for high-density wire-to-board applications. The series offers various configurations to support diverse electronic assembly needs while maintaining signal integrity and mechanical stability in compact form factors.
Replacement Considerations
Consult official Amphenol ICC (FCI) documentation for verified substitute part numbers. Cross-reference pin counts, pitch dimensions, and mounting styles to ensure functional equivalence without modifying the existing PCB footprint.
