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Product Detailed Parameters
- Description：HORIZONTAL HEADER
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：13
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.350" (8.89mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The Amphenol ICC (FCI) 10142344-313KLF is a MicroSpace header assembly designed for wire-to-board connections. It features a 1.27 mm pitch and an 8-position configuration with male pin contacts. The component utilizes a shrouded, two-row design with a 2.43 mm row spacing, intended for surface mount (SMD/SMT) installation at a right angle. Contacts are gold-plated copper alloy, rated for 4 A current and 48 V voltage. Operating temperature ranges from -40°C to +130°C, with UL 94 V-0 flammability rating and black thermoplastic housing.
Feature Summary
- Shrouded two-row architecture providing secure wire retention and alignment
- Surface mount termination optimized for automated PCB assembly processes
- Gold-plated contacts ensuring reliable signal transmission and corrosion resistance
Applications
- Wire-to-board interconnections in compact electronic assemblies
- Signal routing in consumer electronics devices
- Data communication equipment internal wiring
- Industrial control system board interfaces
Procurement Notes
Verify the specific suffix 'KLF' against official Amphenol documentation to confirm lead-free compliance and packaging details. Confirm availability status as this series may be subject to factory special order requirements. Cross-reference the exact position count and row configuration with the latest datasheet to ensure compatibility with existing PCB footprints and mating connectors.
Selection Notes
Select this component when a low-profile, high-density wire-to-board solution is required for SMT manufacturing. Ensure the PCB layout accommodates the right-angle orientation and 2.43 mm row spacing. Verify that the mating wire harness terminals match the 1.27 mm pitch and male pin specifications. Consider thermal management requirements given the +130°C maximum operating temperature limit.
Part Context
This part belongs to the Minitek MicroSpace series by Amphenol FCI, a line of connectors engineered for space-constrained applications. The series emphasizes miniaturization while maintaining electrical reliability through precise contact geometry and robust housing materials. It serves as a standard interconnect solution within broader Amphenol communications and industrial product portfolios.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Consult Amphenol engineering for direct replacements if this specific 8-position variant is unavailable.
