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Product Detailed Parameters
- Description：HORIZONTAL HEADER
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：14
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.350" (8.89mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The Amphenol ICC (FCI) 10142344-314KLF is a Minitek MicroSpace header assembly designed for wire-to-board applications. It features a 1.27 mm pitch with 14 positions arranged in a dual-row configuration. The connector utilizes male pin contacts with gold plating and thermoplastic housing. It supports surface mount termination at a right angle, operating within a temperature range of -40°C to +130°C. Rated for 4 A current and 48 V voltage, it meets UL 94 V-0 flammability standards.
Feature Summary
- Dual-row shrouded design ensures precise alignment and polarity during mating.
- Gold-plated copper alloy contacts provide reliable signal transmission and corrosion resistance.
- Right-angle SMT termination facilitates efficient board space utilization.
- Thermoplastic housing offers structural integrity and thermal stability.
Applications
- Wire-to-board interconnections
- Consumer electronics assemblies
- Industrial control modules
Procurement Notes
Verify the specific suffix 'KLF' against official Amphenol documentation to confirm lead-free compliance and packaging specifications. Ensure the selected variant matches the required row count and contact orientation for your PCB layout. Cross-reference the datasheet for exact reel quantities and handling instructions prior to ordering.
Selection Notes
Select this component when a compact, high-density connection is required for wire-to-board interfaces. The 1.27 mm pitch allows for dense routing while maintaining adequate spacing. Consider the right-angle form factor for constrained vertical spaces and the gold plating for environments requiring long-term reliability without oxidation concerns.
Part Context
This part belongs to the Minitek MicroSpace series by Amphenol FCI, specializing in low-profile interconnect solutions. The series is engineered for modern electronic devices demanding miniaturization and robust performance. It complements other headers in the lineup offering various position counts and termination styles for diverse system architectures.
Replacement Considerations
Consult official substitution guides for compatible alternatives within the Minitek family. Verify that any substitute maintains identical pitch, row configuration, and mounting style to ensure mechanical and electrical compatibility without redesigning the PCB footprint.
