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Product Detailed Parameters
- Description：CONN MICROSPACE HDR-ASSY STG S
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR),Cut Tape (CT)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.059" (1.50mm)
- Number of Positions：2
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.287" (7.30mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：118.1µin (3.00µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
Download product information
Overview
The Amphenol ICC (FCI) part number 10142634-102KLF is a Minitek MicroSpace header assembly designed for wire-to-board interconnections. It features a two-position configuration with a 1.27 mm pitch and dual rows spaced at 2.43 mm. The connector utilizes surface mount termination with straight, tin-plated copper alloy pins housed in a black thermoplastic body rated UL 94 V-0. Operating within a temperature range of -40°C to +130°C, it supports up to 4 A current and offers an insulation resistance of 100 MOhms.
Feature Summary
- Shrouded design provides protection and alignment for mating connections
- Surface mount solder termination ensures secure board attachment
- Tin-plated contacts offer reliable conductivity and corrosion resistance
Applications
- Wire-to-board electrical connections
- Consumer electronics assemblies
- Industrial control systems
Procurement Notes
Verify the specific ordering suffix KLF against manufacturer documentation to confirm lead-free compliance and packaging details. Confirm that the selected variant matches the required pin count and row configuration for your circuit design. Ensure compatibility with automated surface mount placement equipment specifications.
Selection Notes
Select this component when a low-profile, high-density wire-to-board solution is required. The 1.27 mm pitch allows for compact layouts while maintaining adequate spacing. Verify that the operating temperature range and current rating meet the system's thermal and electrical demands before integration.
Part Context
This component belongs to the Minitek MicroSpace 1.27mm series by Amphenol FCI. The series focuses on miniaturized interconnects for space-constrained applications. It represents a standard offering for reliable signal and power transmission in modern electronic devices requiring robust mechanical stability.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Consult official Amphenol catalogs for cross-reference options if direct replacement is necessary.
