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Product Detailed Parameters
- Description：CONN MICROSPACE HDR-ASSY STG S
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR),Cut Tape (CT)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.059" (1.50mm)
- Number of Positions：8
- Number of Rows：1
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.297" (7.54mm)
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：118.1µin (3.00µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The Amphenol ICC (FCI) part number 10142634-108KLF is a Minitek MicroSpace header assembly designed for wire-to-board applications. It features a 1.27 mm pitch and contains 8 positions with male pin contacts. The connector utilizes a shrouded, two-row configuration with a 2.43 mm row spacing. It is engineered for surface mount (SMD/SMT) installation at a straight angle, employing tin-plated copper alloy terminals. The housing is constructed from black thermoplastic material rated UL 94 V-0 for flammability.
Feature Summary
- Shrouded two-row design ensures precise alignment during mating
- Surface mount termination facilitates automated PCB assembly processes
- Tin-plated contacts provide reliable electrical conductivity
Applications
- Wire-to-board interconnections in compact electronic modules
- Signal transmission within data communication equipment
- Integration into industrial control system circuit boards
Procurement Notes
Verify the specific suffix KLF against official manufacturer documentation to confirm lead-free compliance and packaging specifications. Confirm that the ordering code matches the exact position count and row configuration required for your design. Cross-reference the datasheet to ensure the thermal performance ratings align with your operational environment constraints before finalizing procurement.
Selection Notes
Select this component when a low-profile, high-density connection is required for wire-to-board interfaces. The 1.27 mm pitch allows for significant routing density on printed circuit boards. Ensure the design accommodates the specific 2.43 mm row spacing and surface mount footprint requirements defined in the mechanical drawings for proper board layout integration.
Part Context
This component belongs to the Minitek MicroSpace series by Amphenol FCI, which specializes in 1.27 mm pitch interconnect solutions. The series targets applications demanding reliable signal integrity in space-constrained environments. As an Amphenol product, it adheres to rigorous quality standards for durability and electrical performance in modern electronic assemblies.
Replacement Considerations
Consult official substitution lists for direct equivalents. Verify compatibility of mating connectors and PCB footprints if considering alternative part numbers from the same or different manufacturers.
