10142708-04100LF

$2.38

Description：CONN 5.70MM VERTICAL THROU
Series：Minitek® Pwr 5.7
Mfr：Amphenol ICC (FCI)
Package：Tray

SKU:db9c8ae4b699 Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN 5.70MM VERTICAL THROU
Series：Minitek® Pwr 5.7
Mfr：Amphenol ICC (FCI)
Package：Tray
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.224" (5.70mm)
Number of Positions：4
Number of Rows：2
Row Spacing - Mating：0.224" (5.70mm)
Number of Positions Loaded：All
Style：Board to Cable/Wire
Shrouding：Shrouded - 4 Wall
Mounting Type：Through Hole
Termination：Solder
Fastening Type：Locking Ramp
Contact Length - Mating：-
Contact Length - Post：0.147" (3.73mm)
Overall Contact Length：-
Insulation Height：0.583" (14.80mm)
Contact Shape：Square
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：15.0µin (0.38µm)
Contact Finish - Post：Tin
Contact Material：Copper Alloy
Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
Features：Board Guide, Glow Wire Compliant
Operating Temperature：-40°C ~ 105°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Black
Current Rating (Amps)：-
Voltage Rating：600VAC/DC

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10142708-04100LF

Overview

The Amphenol ICC (FCI) 10142708-04100LF is a high-density pin-and-socket cable-to-board connector system designed for compact, power-dense applications. It belongs to the CoolPower® HD series, engineered to deliver robust electrical connections in space-constrained environments. The component utilizes a specialized interconnect architecture to support high current and signal integrity requirements typical of modern industrial and data infrastructure systems.

Feature Summary

High-density interconnect architecture optimized for compact form factors
Designed specifically for power-dense application scenarios
Facilitates reliable cable-to-board connectivity solutions

Applications

Compact electronic equipment requiring high power density
Industrial automation systems with space constraints
Data infrastructure hardware components

Procurement Notes

Verify the specific revision level and packaging configuration against the official datasheet before procurement. Confirm that the CoolPower® HD series specifications align precisely with the target board layout and thermal management requirements. Ensure compatibility with mating connectors within the assembly.

Selection Notes

Select this component when standard connectors cannot meet the spatial or power requirements of the design. Evaluate the mechanical footprint and thermal dissipation capabilities relative to the system's operational limits. Consider the availability of mating counterparts and the long-term supply chain stability for the CoolPower® HD series.

Part Context

This part is part of the CoolPower® HD product line from Amphenol ICC (FCI), focusing on advanced interconnect solutions. The series addresses the industry trend toward miniaturization while maintaining high performance. It serves as a critical link in complex electronic assemblies where reliability and density are paramount.