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Product Detailed Parameters
- Description：CONN MICROSPACE HDR-ASSY STG T
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.100" (2.54mm)
- Number of Positions：6
- Number of Rows：2
- Row Spacing - Mating：0.096" (2.43mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.526" (13.35mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
Download product information
Overview
The Amphenol ICC (FCI) part number 10143535-306KLF is a Minitek MicroSpace 1.80mm Crimp-to-Wire Connector Platform component, specifically designed as a vertical header for surface mount applications. This connector features a six-position configuration intended for wire-to-board interconnections. The design supports reliable electrical transmission within compact electronic assemblies, utilizing a crimp termination method to ensure secure contact with mating wires.
Feature Summary
- Vertical header orientation optimized for surface mount installation on printed circuit boards.
- Utilizes the Minitek MicroSpace 1.80mm platform for consistent spacing and signal integrity.
- Crimp-to-wire termination method ensures robust mechanical and electrical connections.
Applications
- Wire-to-board interconnects in consumer electronics
- Signal transmission in compact data processing equipment
- Internal power and signal routing in telecommunications hardware
Procurement Notes
Verify the specific ordering suffix against the manufacturer's current documentation to confirm pin count and termination style. Ensure compatibility with the designated crimping tooling specified by Amphenol FCI for the MicroSpace series. Confirm that the selected variant meets the required environmental ratings for the target application environment.
Selection Notes
Select this component when a low-profile, vertical header is required for 1.80mm pitch applications. Consider the surface mount footprint constraints and the need for crimped wire terminations. Evaluate the mechanical stability requirements of the assembly to determine if the vertical orientation provides sufficient clearance and connection reliability for the specific board layout.
Part Context
This component belongs to the Minitek MicroSpace family produced by Amphenol ICC (FCI). The series focuses on providing high-density interconnect solutions with a 1.80mm pitch. These connectors are engineered for applications requiring reliable performance in space-constrained environments, offering a balance between signal density and manufacturing ease through standardized crimp interfaces.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify cross-compatibility with other Minitek variants only through official engineering change notices or direct manufacturer consultation.
