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Product Detailed Parameters
- Description：VERTICAL HEADER
- Series：MicroSpace™
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.050" (1.27mm)
- Number of Positions：4
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.526" (13.35mm)
- Contact Shape：Square
- Contact Finish - Mating：-
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：-
- Voltage Rating：-
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Overview
The 10144531-204KLF is a rectangular connector manufactured by Amphenol ICC (FCI). It belongs to the high-speed interconnect portfolio, designed for demanding electronic environments. The component functions as a reliable interface solution within complex circuit architectures.
Feature Summary
- Engineered for high-speed signal transmission and backplane applications
- Optimized for data communication and industrial control systems
- Designed to support medical technology and military technology requirements
Applications
- Embedded systems integration
- Datacom infrastructure connections
- Communication equipment interfaces
- Medical technology devices
- Military technology applications
Procurement Notes
Verify current availability status directly with authorized distributors or the manufacturer, as lead times and stock levels fluctuate. Confirm that the specific part number matches the required pin count and configuration for your design. Ensure compliance with relevant environmental regulations such as RoHS before finalizing procurement decisions for production use.
Selection Notes
Select this component when high-speed performance is critical for system reliability. Consider its suitability for embedded, datacom, and communication applications. Evaluate mechanical fit and electrical requirements against specific project constraints. Validate compatibility with mating connectors and PCB layout specifications during the design phase to ensure optimal signal integrity.
Part Context
This part falls under Amphenol ICC's high-speed interconnect solutions, formerly associated with FCI. It supports advanced connectivity needs in sectors requiring robust signal transmission. The product line emphasizes durability and precision engineering for professional electronic assemblies.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Verify functional equivalence carefully if considering alternative components from other manufacturers.
