10145193-218KLF

Description：VERTICAL HEADER
Series：MicroSpace™
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR)

SKU:ff2023ac97ec Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：VERTICAL HEADER
Series：MicroSpace™
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR)
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.050" (1.27mm)
Number of Positions：18
Number of Rows：2
Row Spacing - Mating：0.081" (2.06mm)
Number of Positions Loaded：All
Style：Board to Cable/Wire
Shrouding：Shrouded - 4 Wall
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Detent Lock
Contact Length - Mating：-
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.526" (13.35mm)
Contact Shape：Square
Contact Finish - Mating：-
Contact Finish Thickness - Mating：-
Contact Finish - Post：Tin
Contact Material：Copper Alloy
Insulation Material：Thermoplastic
Features：Board Guide, Solder Retention
Operating Temperature：-
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Black
Current Rating (Amps)：-
Voltage Rating：-

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10145193-218KLF

Overview

The 10145193-218KLF is a Minitek MicroSpace 1.80mm Crimp-to-Wire Connector Platform header, manufactured by Amphenol ICC (FCI). It features a right-angle, surface-mount design with 18 positions. The connector utilizes a wire-to-board configuration intended for reliable electrical interconnections in compact electronic assemblies.

Feature Summary

Right-angle surface mount topology for space-constrained PCB layouts
Crimp-to-wire termination method ensuring robust mechanical and electrical joints
Minitek MicroSpace 1.80mm pitch platform supporting high-density applications

Applications

Wire-to-board interconnections
Compact electronic device assembly
High-density circuit board integration

Procurement Notes

Verify the specific ordering suffixes to ensure compatibility with required housing colors and contact plating options. Confirm that the selected variant matches the necessary current ratings and environmental specifications for the target application. Cross-reference the manufacturer's latest documentation to validate component availability and any recent design changes or obsolescence notices before finalizing procurement plans.

Selection Notes

Select this component when a low-profile, right-angle connection is required for wire-to-board applications. The 1.80mm pitch offers a balance between density and ease of handling. Ensure the mating wire gauge aligns with the crimp terminal specifications. Consider the surface-mount footprint constraints during PCB layout to guarantee proper solder joint integrity and mechanical stability.

Part Context

This part belongs to the Minitek MicroSpace series, designed for high-reliability connections in consumer electronics and industrial equipment. The 1.80mm pitch allows for dense packing while maintaining sufficient clearance. As an FCI product, it adheres to strict quality standards for signal integrity and durability in demanding operational environments.