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Product Detailed Parameters
- Description：VERTICAL HEADER
- Series：MicroSpace™ 1.27mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.050" (1.27mm)
- Number of Positions：14
- Number of Rows：2
- Row Spacing - Mating：0.081" (2.06mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.526" (13.35mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Solder Retention
- Operating Temperature：-40°C ~ 130°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：4A
- Voltage Rating：48V
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Overview
The Amphenol ICC (FCI) 10145204-314KLF is a Minitek MicroSpace header connector designed for wire-to-board applications. It features a 1.27mm pitch and a side-to-side double row configuration with 14 positions. The component utilizes surface mount termination and includes a top latch mechanism for secure engagement. Constructed as a vertical header, it supports reliable interconnection in compact electronic assemblies requiring high-density wiring solutions.
Feature Summary
- Minitek MicroSpace platform for compact wire-to-board integration
- Side-to-side double row arrangement for high-density routing
- Top latch mechanism ensures secure mating retention
- Surface mount termination facilitates automated PCB assembly
Applications
- Wire-to-board interconnections
- Compact electronic device assembly
- High-density signal routing applications
Procurement Notes
Verify current availability status as the product may be subject to factory special order requirements. Confirm specific packaging details such as reel quantity against latest manufacturer documentation. Ensure compatibility with surface mount reflow processes and verify that the top latch orientation aligns with board layout constraints before finalizing procurement orders.
Selection Notes
Select this component for applications requiring a 1.27mm pitch header with a double-row side-to-side configuration. The surface mount design suits automated manufacturing environments. Consider the top latch feature for enhanced mechanical retention during operation. Verify that the 14-position count meets circuit requirements and that the vertical form factor fits within available spatial constraints on the target printed circuit board.
Part Context
This part belongs to the Minitek MicroSpace series by Amphenol ICC (FCI), a line of connectors engineered for space-constrained environments. The MicroSpace platform emphasizes low profile and high reliability for modern electronics. As a specialized wire-to-board solution, it complements broader FCI portfolios used in data communication and industrial sectors, providing standardized interconnect options for complex system architectures.
Replacement Considerations
No public confirmed substitute part numbers are documented for this specific model. Due to the discontinued or special-order status often associated with legacy Minitek components, direct replacements may require engineering validation. Consult official Amphenol resources for potential family upgrades or alternative series with compatible pin counts and pitch specifications.
