10145445-10003MLF

Edgeboard Connectors Overview

The Amphenol ICC (FCI) part number 10145445-10003MLF is a PCI Express female card edge connector. It features a gold contact finish and a 0.039-inch pitch. This component is designed for high-reliability data transmission applications in electronic systems requiring secure board-to-board or backplane connections.

Edgeboard Connectors Feature Summary

• Female contact configuration for mating with male card edge connectors
• Gold-plated contacts to ensure reliable signal integrity and corrosion resistance
• Standardized 0.039-inch pitch spacing for compatibility with industry-standard card edges

Edgeboard Connectors Applications

• PCI Express expansion cards
• High-speed data transmission modules
• Server and storage system interconnects

Edgeboard Connectors Procurement Notes

Verify the specific suffix 'MLF' against official Amphenol documentation to confirm material composition and lead-free status. Ensure the requested quantity matches manufacturer minimum order requirements. Confirm current availability through authorized distributors, as supply levels may vary by region and production cycle.

Edgeboard Connectors Selection Notes

Select this connector when a female PCI Express interface with gold contacts is required. The 0.039-inch pitch must match the mating card edge dimensions. Verify that the application environment supports the connector's mechanical and electrical ratings for long-term reliability.

Edgeboard Connectors Part Context

This component belongs to the PCI Express connector family from Amphenol ICC (FCI). It serves as a critical interface element in modern computing architectures, facilitating high-bandwidth communication between peripheral cards and host systems within standardized form factors.

Edgeboard Connectors Replacement Considerations

Consult official cross-reference lists for verified substitute part numbers. Ensure any replacement maintains identical pitch, contact plating, and gender specifications to guarantee mechanical fit and electrical performance without redesigning the host assembly.