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10145920-002LF is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN EDGE DUAL FMALE 38POS GOLD. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) part number 10145920-002LF is a dual-edge female edge card connector designed for high-performance computing applications. It features 38 positions, with 32 loaded contacts arranged to support both signal and power transmission requirements. The connector utilizes a copper alloy contact material finished with gold or Gold GXT™ plating to ensure reliable electrical performance. The housing is constructed from black thermoplastic plastic, providing structural integrity and environmental resistance. This component is intended for through-hole mounting on printed circuit boards.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm pin count, contact finish, and housing color variations. Ensure that the selected variant matches the required signal and power distribution specifications for the target application. Cross-reference the basic product number 10145920 with authorized distributors to confirm current availability and compliance with relevant regulatory standards such as RoHS.
Select this connector based on the requirement for a dual-edge female interface with 38 total positions. Confirm compatibility with the mating card thickness and the specific PCB layout constraints for through-hole assembly. Evaluate the need for Gold GXT™ versus standard gold plating based on the operational environment and cycle life expectations. Ensure the board lock feature aligns with the mechanical design of the enclosure.
This component belongs to the HPCE® series by Amphenol ICC (FCI), which specializes in high-speed, high-density interconnect solutions. The series is engineered to meet the demanding electrical and mechanical requirements of modern data centers and high-performance computing architectures. The dual-edge design allows for increased I/O density within a compact form factor.
Public confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer's official cross-reference guide for verified alternatives.
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