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The Amphenol ICC (FCI) part number 10146099-208KLF is a Minitek MicroSpace 1.80mm crimp-to-wire connector header from the FCI Basics product line. It features a right-angle, surface-mount design with 8 positions and a single row. The connector utilizes a wire-to-board style for interconnecting cables to printed circuit boards. The housing is constructed from thermoplastic material rated UL94 V-0 for flammability. Contact termination is achieved via crimping onto wire ends, while the board side employs surface mount soldering. This component belongs to the Minitek family of connectors designed for compact electronic assemblies.
Verify the specific suffix KLF against the manufacturer's current datasheet to confirm plating specifications and environmental compliance status. Ensure the ordering quantity aligns with the manufacturer's standard packaging units. Confirm that the right-angle surface mount footprint matches the target PCB design constraints before finalizing procurement orders.
Select this component when a 1.80mm pitch right-angle header is required for surface mount applications. The 8-position single-row format suits moderate density wiring needs. Consider the crimp termination requirement for wire preparation tools. Verify thermal resistance ratings against soldering process temperatures to ensure housing integrity during assembly.
This part belongs to the Amphenol FCI Minitek MicroSpace series, a widely used line of wire-to-board connectors. The Minitek platform offers various pitch options and mounting styles to support diverse electronic interconnection requirements across automotive, industrial, and consumer markets. The 10146099 series specifically addresses applications needing reliable, compact signal routing.
Direct substitutes within the same Minitek MicroSpace 1.80mm family may include variants with different position counts or mounting orientations. Cross-reference pin counts and mechanical dimensions before substituting. No alternative part numbers are explicitly confirmed as direct replacements in available public documentation.