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Product Detailed Parameters
- Description：HORIZONTAL HEADER
- Series：MicroSpace™ 1.80mm
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.071" (1.80mm)
- Number of Positions：20
- Number of Rows：2
- Row Spacing - Mating：0.081" (2.06mm)
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount, Right Angle
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.317" (8.05mm)
- Contact Shape：Square
- Contact Finish - Mating：-
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Solder Retention
- Operating Temperature：-
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Black
- Current Rating (Amps)：-
- Voltage Rating：-
Download product information
Overview
The Amphenol ICC (FCI) part number 10146099-220KLF is a Minitek MicroSpace connector component belonging to the 1.80mm Crimp-to-Wire Connector Platform. It functions as a wire-to-board right-angle header designed for surface mount technology. The assembly features a 20-position configuration, providing electrical interconnection between flexible wiring harnesses and printed circuit boards within compact electronic systems.
Feature Summary
- Right-angle header geometry facilitates vertical board mounting while maintaining horizontal cable routing.
- Surface mount construction enables automated placement and secure attachment to PCB traces.
- Crimp-to-wire termination method ensures reliable mechanical and electrical connections.
Applications
- Wire-to-board interconnections in consumer electronics
- Signal transmission in compact data processing equipment
- Internal cabling in telecommunications hardware
Procurement Notes
Verify the specific suffix KLF against official manufacturer documentation to confirm plating material and environmental compliance ratings. Confirm that the 20-position count matches the required circuit density. Ensure the right-angle orientation aligns with the mechanical layout constraints of the target printed circuit board design before finalizing procurement.
Selection Notes
Select this component when a low-profile, high-density connection is required for wire-to-board applications. The 1.80mm pitch allows for tighter spacing compared to standard connectors. The right-angle form factor is suitable for space-constrained enclosures where cable exit direction must be perpendicular to the board plane. Surface mount compatibility supports high-volume manufacturing processes.
Part Context
This component belongs to the Minitek MicroSpace series by Amphenol ICC (formerly FCI). The platform specializes in small-pitch interconnect solutions for modern electronics. The 1.80mm pitch represents a balance between signal density and manufacturability. The product line targets applications requiring reliable performance in limited spatial environments.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Cross-referencing requires matching the 1.80mm pitch, 20-position count, right-angle orientation, and surface mount termination type with alternative manufacturers' catalogs.
