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The 10146171-104KLF is a Minitek MicroSpace 1.80mm crimp-to-wire connector header manufactured by Amphenol ICC (FCI). It features a vertical, surface-mount design with 4 positions and a single row. The connector utilizes a shrouded housing to ensure proper alignment during mating. Contact materials are typically copper alloy with gold plating for reliable signal transmission. The unit is designed for wire-to-board applications requiring compact interconnect solutions.
Verify the specific contact material and plating thickness against the official datasheet before integration. Confirm that the selected housing color matches system requirements. Ensure the manufacturing date code aligns with project timelines. Check for any recent product change notices affecting material composition or dimensions.
Select this component when a low-profile, vertically mounted header is required for 1.80mm pitch applications. The shrouded design is critical for preventing misalignment in automated assembly processes. Consider the crimp termination requirement versus solder tail options based on available tooling and board layout constraints.
This part belongs to the Minitek MicroSpace series, which focuses on high-density interconnects. The 1.80mm pitch allows for tighter spacing compared to standard 2.00mm headers. It is part of Amphenol's portfolio of reliable, cost-effective connectors for mass-produced electronic devices.
Direct substitutes must maintain the 1.80mm pitch, 4-position count, and vertical surface-mount form factor. Verify compatibility with existing crimp tools and mating receptacles. Cross-reference with other Minitek variants if availability issues arise.