10146173-216KLF

10146173-216KLF

  • Description:CONN SHRD HDR STRT
  • Series:MicroSpace™
  • Mfr:Amphenol ICC (FCI)
  • Package:Tape & Reel (TR)

SKU:aa786ad231e4 Category: Brand:

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Product Detailed Parameters

  • Description:CONN SHRD HDR STRT
  • Series:MicroSpace™
  • Mfr:Amphenol ICC (FCI)
  • Package:Tape & Reel (TR)
  • Connector Type:Header
  • Contact Type:Male Pin
  • Pitch - Mating:0.071" (1.80mm)
  • Number of Positions:16
  • Number of Rows:2
  • Row Spacing - Mating:0.081" (2.06mm)
  • Number of Positions Loaded:All
  • Style:Board to Cable/Wire
  • Shrouding:Shrouded - 4 Wall
  • Mounting Type:Surface Mount
  • Termination:Solder
  • Fastening Type:Latch Holder
  • Contact Length - Mating:-
  • Contact Length - Post:-
  • Overall Contact Length:-
  • Insulation Height:0.526" (13.35mm)
  • Contact Shape:Square
  • Contact Finish - Mating:-
  • Contact Finish Thickness - Mating:-
  • Contact Finish - Post:Tin
  • Contact Material:Copper Alloy
  • Insulation Material:Thermoplastic
  • Features:Board Guide, Solder Retention
  • Operating Temperature:-
  • Ingress Protection:-
  • Material Flammability Rating:UL94 V-0
  • Insulation Color:Black
  • Current Rating (Amps):-
  • Voltage Rating:-

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10146173-216KLF

Overview

The Amphenol ICC (FCI) model 10146173-216KLF is a Minitek MicroSpace 1.80mm crimp-to-wire connector platform component, specifically designed as a vertical header for surface mount termination. This wire-to-board connector features a 16-position configuration with a 1.80mm pitch. The unit utilizes a dual-row arrangement to accommodate the specified contact count within a compact footprint. It is engineered for reliable electrical interconnection in space-constrained electronic assemblies requiring robust surface mounting capabilities.

Feature Summary

  • Vertical orientation design for direct surface mount integration onto printed circuit boards
  • Crimp-to-wire termination method ensuring secure and durable wire connections
  • Minitek MicroSpace 1.80mm pitch architecture supporting high-density layout requirements

Applications

  • Wire-to-board interconnections in consumer electronics
  • Signal transmission in industrial control systems
  • Data communication equipment internal wiring

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm pin configuration and plating options. Ensure compatibility with mating housing components from the same Minitek MicroSpace series. Confirm that the selected variant meets the required thermal and mechanical specifications for the target application environment before finalizing procurement.

Selection Notes

Select this component when a vertical, surface-mount wire-to-board solution with a 1.80mm pitch is required. The 16-position capacity suits applications needing moderate channel counts in limited board areas. Consider the crimp termination style for assembly process alignment and verify that the vertical profile fits within the system's height constraints.

Part Context

This part belongs to the Amphenol Minitek MicroSpace family, which specializes in compact, high-reliability interconnect solutions. The 1.80mm pitch series balances density with ease of handling. As an FCI product now under Amphenol, it inherits established standards for signal integrity and mechanical durability used across various electronic sectors.

Replacement Considerations

Direct replacements must match the 1.80mm pitch, 16-position count, vertical header form factor, and surface mount termination type. Verify that any substitute maintains identical housing polarization and mating interface dimensions to ensure seamless integration without redesigning the PCB or harness.

10146173-216KLF10146173-216KLF

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