10147605-00013LF

Description：CONN 1.0 V/T SMT HDR
Series：Minitek® 1.00mm
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR)

SKU:009622d6fc71 Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN 1.0 V/T SMT HDR
Series：Minitek® 1.00mm
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR)
Connector Type：Header
Contact Type：Male Pin
Pitch - Mating：0.039" (1.00mm)
Number of Positions：13
Number of Rows：1
Row Spacing - Mating：-
Number of Positions Loaded：All
Style：Board to Cable/Wire
Shrouding：Shrouded - 4 Wall
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Push-Pull
Contact Length - Mating：-
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.169" (4.30mm)
Contact Shape：Rectangular
Contact Finish - Mating：Tin
Contact Finish Thickness - Mating：-
Contact Finish - Post：Tin
Contact Material：Brass
Insulation Material：Polyamide (PA9T), Nylon 9T
Features：Solder Retention
Operating Temperature：-25°C ~ 85°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Natural
Current Rating (Amps)：1A
Voltage Rating：50VAC

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10147605-00013LF

Overview

The Amphenol ICC (FCI) part number 10147605-00013LF is a Minitek 1.00mm series wire-to-board header connector. It features a single row of thirteen positions with a 0.039-inch (1.00mm) pitch. The contacts are gold-plated phosphor bronze sockets designed for crimp termination, while the housing utilizes natural-colored polyamide (PA9T). This surface-mount component includes a four-wall shield and fixed solder tails for secure PCB attachment.

Feature Summary

Four-wall shielding design for enhanced signal integrity
Fixed solder tail configuration for reliable surface mount retention
Gold-plated phosphor bronze socket contacts for durability

Applications

Wire-to-board interconnections in consumer electronics
Signal transmission in compact data communication devices
Internal connections within industrial control modules

Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm contact plating thickness and material composition. Ensure the selected variant matches the required current rating and voltage specifications for the target application environment. Cross-reference the RoHS compliance status with the latest datasheet revision prior to final procurement decisions.

Selection Notes

Select this component when a low-profile, high-density connection is required for wire-to-board applications. The 1.00mm pitch allows for compact board layouts compared to larger spacing options. Consider the four-wall shield feature if electromagnetic interference protection is necessary for the connected circuitry within the assembly.

Part Context

This connector belongs to the Minitek 1.00mm product line manufactured by Amphenol ICC (FCI). The series provides cost-effective solutions for various electronic assemblies. The specific model represents a standard header configuration within this family, designed for general-purpose signal distribution in modern electronic devices requiring reliable connectivity.