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Product Detailed Parameters
- Description：MTK HEADER ASSY DR BMI-8POS 0.76
- Series：Minitek® 2.00mm
- Mfr：Amphenol ICC (FCI)
- Package：Tube
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.079" (2.00mm)
- Number of Positions：8
- Number of Rows：2
- Row Spacing - Mating：0.079" (2.00mm)
- Number of Positions Loaded：All
- Style：Board to Board or Cable
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Through Hole
- Termination：Solder
- Fastening Type：Latch Holder
- Contact Length - Mating：-
- Contact Length - Post：0.098" (2.50mm)
- Overall Contact Length：-
- Insulation Height：0.409" (10.40mm)
- Contact Shape：Square
- Contact Finish - Mating：Gold, GXT™
- Contact Finish Thickness - Mating：30.0µin (0.76µm)
- Contact Finish - Post：Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：-
- Operating Temperature：-40°C ~ 125°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：2A per Contact
- Voltage Rating：200V
Download product information
Overview
The 10148138-G0108ULF is a Minitek blindmate header manufactured by Amphenol ICC (FCI). It features a 2.00mm pitch and an 8-position configuration with male pin contacts. Designed for board-to-board applications, this component utilizes surface mount termination and includes a press-fit locking mechanism to ensure secure mating. The connector operates within a temperature range of -55°C to 125°C and meets UL94 V-0 flammability standards.
Feature Summary
- Blindmate design enables precise alignment without visual guidance during assembly
- Integrated press-fit locking mechanism ensures secure connection stability
- Surface mount termination supports automated PCB manufacturing processes
Applications
- Board-to-board interconnections in electronic assemblies
- High-density signal routing in compact devices
- Automated manufacturing environments requiring blind mating
Procurement Notes
Verify the specific suffix G0108ULF against official Amphenol documentation to confirm contact plating and housing material specifications. Ensure compatibility with existing PCB footprints and mating connectors before procurement. Cross-reference datasheet revisions to validate current production status and environmental compliance requirements.
Selection Notes
Select this component when blindmate functionality and high-density board-to-board connections are required. The 2.00mm pitch offers a balance between signal density and spacing reliability. Consider the press-fit locking feature for applications demanding robust mechanical retention during vibration or thermal cycling.
Part Context
This part belongs to the Minitek series, characterized by its blindmate capability and compact form factor. The series is designed for high-reliability applications where space constraints and automated assembly efficiency are critical priorities. It represents a specialized solution within Amphenol's broader interconnect portfolio.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify cross-compatibility with alternative headers based on pitch, pin count, and mounting style before substitution.
