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10151114-001TLF is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN PCI EXP FMALE 314POS 0.020. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) 10151114-001TLF is a high-density MXM 3.0 edgeboard connector designed for surface mount technology. It features a right-angle configuration with 314 positions and a 0.020-inch (0.50mm) pitch. The connector utilizes gold contact finishes to ensure reliable signal integrity in demanding applications. With a stack height of 0.50mm, it supports compact board-to-board interconnections.
Verify the specific suffix 'TLF' against official Amphenol documentation to confirm lead-free compliance and packaging specifications. Ensure the right-angle orientation matches the PCB footprint requirements. Cross-reference the 314-position count with the mechanical drawing to prevent assembly errors during integration.
Select this component when a low-profile, high-pin-count interface is required for MXM form factors. The right-angle SMT style facilitates vertical stacking or side-mounted connections. Evaluate the 0.50mm pitch density against routing constraints and thermal management needs within the host system architecture.
This part belongs to the MXM series by Amphenol ICC (FCI), formerly FCI. The series targets mobile and embedded graphics solutions requiring robust electrical performance. The manufacturer integrates advanced plating technologies to support signal integrity in high-frequency data transmission environments typical of modern computing hardware.
Public confirmed substitute part numbers are not available in the provided source material.
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