10152252-112ALF

Description：CONN MICROSPACE HEADER AS
Series：-
Mfr：Amphenol ICC (FCI)
Package：Bulk

SKU:ca180d731557 Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：CONN MICROSPACE HEADER AS
Series：-
Mfr：Amphenol ICC (FCI)
Package：Bulk
Connector Type：-
Contact Type：-
Pitch - Mating：-
Number of Positions：-
Number of Rows：-
Row Spacing - Mating：-
Number of Positions Loaded：-
Style：-
Shrouding：-
Mounting Type：-
Termination：-
Fastening Type：-
Contact Length - Mating：-
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：-
Contact Shape：-
Contact Finish - Mating：-
Contact Finish Thickness - Mating：-
Contact Finish - Post：-
Contact Material：-
Insulation Material：-
Features：-
Operating Temperature：-
Ingress Protection：-
Material Flammability Rating：-
Insulation Color：-
Current Rating (Amps)：-
Voltage Rating：-

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10152252-112ALF

Overview

The Amphenol ICC (FCI) part number 10152252-112ALF is a MicroSpace header assembly designed for surface mount termination. This component features a vertical orientation with a total of twelve positions arranged in a single row. The connector utilizes gold-plated contacts housed within a black thermoplastic insulator, ensuring reliable signal transmission and environmental resistance. It is classified as a lead-free and RoHS compliant product suitable for modern electronic manufacturing processes requiring strict material standards.

Feature Summary

Vertical surface mount design for space-constrained applications
Gold-plated contact surfaces for enhanced conductivity
Lead-free construction compliant with RoHS directives

Applications

Mobile computing devices
Consumer electronics
Wearable technology

Procurement Notes

Verify the specific suffix ALF against the official datasheet to confirm lead-free status and plating thickness requirements. Ensure the ordering quantity matches the standard packaging configuration provided by the manufacturer. Cross-reference the revision level to guarantee compatibility with existing PCB footprints and mating components.

Selection Notes

Select this component when a low-profile, single-row vertical header is required for board-to-board or cable-to-board connections. Evaluate the mechanical height constraints and thermal management needs during the design phase. Confirm that the contact spacing and current rating align with the system's electrical specifications and mating interface requirements.

Part Context

This connector belongs to the MicroSpace series, which focuses on miniaturized interconnect solutions for high-density applications. The series supports various configurations tailored for mobile and consumer markets. The specific model represents a standardized solution within the broader portfolio of Amphenol FCI interconnect systems.