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10154478-067RDALF is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is M.2 H8.5_STD_A. Review the specifications below when checking this part for your BOM.
The Amphenol ICC (FCI) part number 10154478-067RDALF is a card edge connector designed for M.2 applications, specifically supporting the A-key configuration with an 8.5mm height standard. This component features a dual-edge contact design accommodating 67 positions with a 0.50mm pitch. The contacts are gold-plated to ensure reliable signal transmission in high-performance computing environments. It serves as a surface-mount interface for connecting M.2 modules to host boards.
Verify the specific keying configuration and mechanical dimensions against the target PCB layout before procurement. Confirm that the dual-edge contact orientation matches the host board design requirements. Ensure compliance with RoHS directives if required by the end product specifications. Cross-reference the official datasheet for precise mating force and retention characteristics.
Select this connector when designing systems requiring M.2 A-key form factor support with an 8.5mm vertical clearance constraint. Consider the 67-position count and 0.50mm pitch compatibility with the intended peripheral module. Evaluate the dual-edge contact style for its suitability in high-density board-to-board connections where space efficiency is critical.
This component belongs to the M.2 connector family from Amphenol ICC (FCI), engineered for modern portable and industrial computing platforms. It facilitates the connection of small form-factor expansion cards, enabling compact system designs while maintaining high-speed data throughput capabilities essential for contemporary electronic devices.
Consult the manufacturer's cross-reference guide for verified substitute part numbers. Ensure any replacement maintains identical mechanical dimensions, contact pitch, and keying configuration to guarantee physical compatibility and electrical performance without redesigning the host printed circuit board.
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