10155502-A106KLF

Overview

The Amphenol ICC (FCI) part number 10155502-A106KLF is a MicroSpace™ 1.27mm series board-to-cable/wire connector header. It features a 6-position, 2-row configuration with male pin contacts and a 0.100 inch (2.54mm) mating pitch. The component utilizes solder retention mechanisms to ensure secure terminal positioning during assembly. Key structural characteristics include integrated board guide features for precise alignment and primary/secondary contact retention systems designed to maintain electrical integrity under mechanical stress.

Feature Summary

• Incorporates primary and secondary contact retention systems to ensure reliable electrical connections and prevent terminal dislodgement.
• Features terminal positioning assurance (TPA) technology to guarantee correct socket engagement and signal stability.
• Includes integrated board guide mechanisms to facilitate accurate alignment and simplified installation processes.

Applications

• Compact electronic device interconnections requiring high-density board-to-wire solutions
• Industrial control modules utilizing standardized 2.54mm mating pitches
• Consumer electronics assemblies demanding robust connector positioning assurance

Procurement Notes

Verify the specific suffix KLF against current manufacturer documentation to confirm compliance with RoHS3 directives and lead-free requirements. Ensure that the selected variant matches the required contact retention specifications and housing material properties for the intended operational environment. Cross-reference the official datasheet for any recent product change notices or obsolescence alerts prior to finalizing procurement orders.

Selection Notes

Select this component when a low-profile, 6-position header is required for applications necessitating precise board alignment and secure terminal locking. The 1.27mm series design supports space-constrained layouts while maintaining standard 2.54mm mating compatibility. Evaluate the need for TPA features in high-vibration environments to ensure long-term connection reliability and signal integrity throughout the product lifecycle.

Part Context

This connector belongs to the MicroSpace™ 1.27mm family, engineered for high-density interconnect applications within compact electronic systems. The series emphasizes reliable signal transmission through advanced retention technologies and precise mechanical alignment features. Designed by Amphenol ICC (FCI), these components support diverse industrial and consumer applications requiring robust, space-efficient board-to-wire connectivity solutions.

Replacement Considerations

Consult official manufacturer substitution lists for verified equivalents. Generic cross-references may not replicate the specific TPA and retention mechanisms inherent to this model.

FAQ

What is the mating pitch specification for this connector?

The connector features a 0.100 inch (2.54mm) mating pitch, ensuring compatibility with standard spacing requirements.

Does this component include terminal positioning assurance?

Yes, the connector incorporates terminal positioning assurance (TPA) to ensure proper socket engagement and maintain connection stability.