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Product Detailed Parameters
- Description：0.8MM PITCH V_T HEADER S-1015684
- Series：FitMate
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR),Cut Tape (CT)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.031" (0.80mm)
- Number of Positions：10
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：-
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：-
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Solder Retention
- Operating Temperature：-25°C ~ 85°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：0.5A
- Voltage Rating：-
Download product information
Overview
The Amphenol ICC (FCI) part number 10156841-10021LF is a FitMate™ wire-to-board connector system designed for fine-pitch applications requiring compact and low-profile solutions. It utilizes Liquid Crystal Polymer (LCP) insulation material that is halogen-free, ensuring compliance with environmental standards. The connector features tin plating on the mating contacts to provide reliable electrical conductivity and corrosion resistance. Constructed with copper alloy contacts, this component supports efficient signal transmission in space-constrained electronic assemblies.
Feature Summary
- Designed for fine-pitch wire-to-board applications
- Compact and low-profile form factor
- Halogen-free Liquid Crystal Polymer (LCP) insulation
Applications
- Fine-pitch wire-to-board interconnections
- Space-constrained electronic device assembly
- Low-profile circuit board connections
Procurement Notes
Verify the specific contact finish and material specifications against the latest manufacturer datasheet before procurement. Confirm that the LCP insulation meets project requirements for halogen-free compliance. Ensure compatibility with existing wire gauges and mating connectors within the design constraints.
Selection Notes
Select this component when a low-profile, fine-pitch wire-to-board solution is required. The use of LCP insulation offers benefits for high-temperature stability and halogen-free compliance. Verify that the tin-plated copper alloy contacts meet the electrical performance needs of the application.
Part Context
This part belongs to the FitMate™ series by Amphenol ICC (FCI), which specializes in wire-to-board connectivity. The series focuses on providing reliable interconnects for modern electronics where space is limited. The specific model integrates standard materials like LCP and copper alloy to balance performance and manufacturability.
FAQ
What is the insulation material used in this connector?
The insulation material is Liquid Crystal Polymer (LCP), which is specified as halogen-free.
What type of contact plating does this connector feature?
The mating contacts are plated with tin to ensure reliable electrical connection.
