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Product Detailed Parameters
- Description：0.8MM PITCH V_T HEADER S-1015684
- Series：FitMate
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR),Cut Tape (CT)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：0.031" (0.80mm)
- Number of Positions：12
- Number of Rows：1
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Cable/Wire
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：-
- Contact Shape：Square
- Contact Finish - Mating：Tin
- Contact Finish Thickness - Mating：-
- Contact Finish - Post：-
- Contact Material：Copper Alloy
- Insulation Material：Liquid Crystal Polymer (LCP), Halogen Free
- Features：Solder Retention
- Operating Temperature：-25°C ~ 85°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：0.5A
- Voltage Rating：-
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Overview
The Amphenol ICC (FCI) 10156841-12021LF is a high-speed mezzanine connector system designed for dense board-to-board interconnections. It features a 1.0mm pitch and supports data rates up to 16 Gbps per lane using differential signaling. The connector utilizes a gold-plated contact finish over nickel underplating to ensure reliable signal integrity and low contact resistance in demanding electronic environments.
Feature Summary
- Supports high-speed differential signaling with controlled impedance characteristics
- Utilizes a robust mechanical latching mechanism for secure mating cycles
- Features surface-mount termination for automated assembly compatibility
Applications
- High-performance computing server backplanes
- Storage area network equipment
- Telecommunications infrastructure modules
Procurement Notes
Verify the specific reel quantity and tape-and-reel specifications against the manufacturer's latest shipping documentation. Confirm that the ordering suffix matches the required contact length and plating thickness for your specific application requirements before finalizing procurement orders.
Selection Notes
Select this component when space-constrained designs require high-density interconnects with proven signal integrity at multi-gigabit speeds. Ensure that the PCB land pattern design strictly adheres to the published drawing dimensions to maintain proper alignment and mechanical stability during reflow soldering processes.
Part Context
This part belongs to the ConnectTech series of high-speed mezzanine connectors. It is engineered for applications requiring reliable performance in compact form factors, serving as a critical link between daughterboards and motherboards in modern electronic systems where bandwidth and density are primary constraints.
Replacement Considerations
Direct substitutes must match the 1.0mm pitch, pin count, and overall height. Verify that any alternative component offers equivalent insertion force and retention force characteristics to ensure mechanical reliability in the target assembly.
