ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：INTERCONNECT RECTANGULAR
- Series：ComboStak®
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：-
- Number of Positions：8 (6 + 2 Power)
- Number of Rows：2
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Board
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.224" (5.69mm)
- Contact Shape：Rectangular
- Contact Finish - Mating：Gold, GXT™
- Contact Finish Thickness - Mating：29.5µin (0.75µm)
- Contact Finish - Post：Gold
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Pick and Place, Solder Retention
- Operating Temperature：-55°C ~ 125°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：-
- Voltage Rating：100VDC
Download product information
Overview
The Amphenol ICC (FCI) part number 10159558-206242RLF is a rectangular interconnect header designed for surface mount technology. This component features an 8-position configuration, structured as 6 signal contacts and 2 dedicated power contacts. It utilizes a vertical orientation to facilitate board-to-board or board-to-wire connections in compact electronic assemblies. The connector is engineered to provide reliable electrical pathways within high-density circuit layouts.
Feature Summary
- Surface mount construction for automated assembly integration
- Dual-purpose contact arrangement combining signal and power lines
- Vertical profile design optimizing spatial efficiency on printed circuit boards
Applications
- High-density electronic module interconnections
- Compact consumer device internal wiring
- Industrial control board signal routing
Procurement Notes
Verify the specific suffix 'RLF' against the manufacturer's latest datasheet to confirm reel packaging specifications and tape dimensions. Ensure compatibility with standard reflow soldering profiles. Cross-reference the pinout diagram to validate the 6+2 signal and power separation matches the target circuit design requirements before finalizing procurement orders.
Selection Notes
Select this component when a mixed-signal solution is required in a single vertical header footprint. The dual power and signal layout reduces the need for separate connectors. Verify that the surface mount pads align with the PCB copper layout and that the vertical height fits within the enclosure constraints of the final assembly.
Part Context
This part belongs to the Amphenol ICC (FCI) rectangular interconnect family, which focuses on providing robust solutions for modern electronics. The series emphasizes reliability and space-saving designs suitable for applications where board real estate is limited. It represents the manufacturer's approach to integrating multiple connection types into unified components.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires matching the 8-position count, 6+2 pin configuration, surface mount mounting style, and vertical orientation. Consult the manufacturer for current equivalent listings if this specific variant is unavailable.
