10159558-410421RLF

$2.75

Description：COMBOSTAK VERTICAL HEADER 2P10S2
Series：ComboStak®
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR),Cut Tape (CT),Spool

SKU:b51f459612ac Category: Headers, Male Pins Brand: Amphenol ICC (FCI)

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Product introduction

Product Detailed Parameters

Description：COMBOSTAK VERTICAL HEADER 2P10S2
Series：ComboStak®
Mfr：Amphenol ICC (FCI)
Package：Tape & Reel (TR),Cut Tape (CT),Spool
Connector Type：Header
Contact Type：Male Blade
Pitch - Mating：0.031" (0.80mm)
Number of Positions：14 (10 + 4 Power)
Number of Rows：2
Row Spacing - Mating：-
Number of Positions Loaded：All
Style：Board to Cable/Wire
Shrouding：Shrouded - 4 Wall
Mounting Type：Surface Mount
Termination：Solder
Fastening Type：Detent Lock
Contact Length - Mating：-
Contact Length - Post：-
Overall Contact Length：-
Insulation Height：0.303" (7.70mm)
Contact Shape：Rectangular
Contact Finish - Mating：Gold or Gold, GXT™
Contact Finish Thickness - Mating：8.00µin (0.203µm)
Contact Finish - Post：-
Contact Material：Copper Alloy
Insulation Material：Thermoplastic
Features：Board Guide, Pick and Place, Solder Retention
Operating Temperature：-40°C ~ 125°C
Ingress Protection：-
Material Flammability Rating：UL94 V-0
Insulation Color：Natural
Current Rating (Amps)：-
Voltage Rating：100VDC

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10159558-410421RLF

Overview

The Amphenol ICC (FCI) 10159558-410421RLF is a ComboStak® board-to-wire header featuring a 0.80mm pitch and a 14-position configuration, comprising 10 signal and 4 power contacts. It utilizes a vertical surface-mount design with solder retention and pick-and-place capabilities. The connector supports high current capacity up to 20A per power blade and signal speeds reaching 12Gb/s. Rated for 100VDC, it includes board guide features for precise alignment during assembly.

Feature Summary

High current capacity supporting up to 20A per power blade
Signal transmission speeds up to 12Gb/s
Integrated board guide for accurate alignment
Surface mount construction with solder retention

Applications

Server and storage equipment interconnects
Communication device backplanes
High-density data processing systems

Procurement Notes

Verify the specific pin count and power/signal distribution against your schematic requirements. Confirm that the surface-mount footprint matches your PCB layout guidelines. Ensure compatibility with automated pick-and-place equipment due to the component's design specifications.

Selection Notes

Select this model when high-speed signal integrity and significant current carrying capacity are required in a compact form factor. The 0.80mm pitch allows for dense routing. Consider the vertical orientation and stack height constraints relative to adjacent components on the board.

Part Context

This component belongs to the ComboStak® series by Amphenol ICC (FCI), designed for demanding applications requiring robust electrical connections. The series offers various stack heights and configurations to accommodate different system architectures while maintaining signal performance.