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Product Detailed Parameters
- Description：INTERCONNECT RECTANGULAR
- Series：ComboStak®
- Mfr：Amphenol ICC (FCI)
- Package：Tape & Reel (TR)
- Connector Type：Header
- Contact Type：Male Pin
- Pitch - Mating：-
- Number of Positions：80 (70 + 10 Power)
- Number of Rows：2
- Row Spacing - Mating：-
- Number of Positions Loaded：All
- Style：Board to Board
- Shrouding：Shrouded - 4 Wall
- Mounting Type：Surface Mount
- Termination：Solder
- Fastening Type：Push-Pull
- Contact Length - Mating：-
- Contact Length - Post：-
- Overall Contact Length：-
- Insulation Height：0.264" (6.70mm)
- Contact Shape：Rectangular
- Contact Finish - Mating：Gold, GXT™
- Contact Finish Thickness - Mating：8.00µin (0.203µm)
- Contact Finish - Post：Gold, Tin
- Contact Material：Copper Alloy
- Insulation Material：Thermoplastic
- Features：Board Guide, Pick and Place, Solder Retention
- Operating Temperature：-55°C ~ 125°C
- Ingress Protection：-
- Material Flammability Rating：UL94 V-0
- Insulation Color：Natural
- Current Rating (Amps)：-
- Voltage Rating：100VDC
Download product information
Overview
The Amphenol ICC (FCI) part number 10159558-A70321RLF is a ComboStak vertical header connector with a 0.80mm pitch. It features a total of 80 positions, comprising 70 signal contacts and 10 power contacts. The component utilizes copper alloy materials for its contacts and thermoplastic insulation. Key features include board guide alignment, pick-and-place compatibility, and solder retention capabilities. It operates within a temperature range of -55°C to 125°C.
Feature Summary
- ComboStak vertical header design integrating signal and power contacts in a single assembly
- Zero insertion force mechanism with pick-and-place capability for automated manufacturing
- Board guide alignment system ensuring precise mating during installation
Applications
- High-density electronic assemblies requiring combined signal and power routing
- Industrial equipment utilizing vertical interconnect solutions
- Automotive electronics systems demanding robust thermal performance
Procurement Notes
Verify the specific suffix 'A70321RLF' against official Amphenol documentation to confirm exact contact configuration and plating specifications. Ensure that the required signal-to-power ratio matches the 70:10 distribution defined for this variant. Cross-reference lead times and RoHS compliance status directly with the manufacturer before finalizing procurement orders.
Selection Notes
Select this component when a high-density vertical header solution is required for applications needing both extensive signal lines and dedicated power channels. The 0.80mm pitch allows for compact board layouts while maintaining reliable electrical connections. Consider the operating temperature range and mechanical locking features when evaluating suitability for harsh environments or high-vibration scenarios.
Part Context
This component belongs to the ComboStak series by Amphenol ICC (FCI), designed for high-density interconnect needs. The series integrates signal and power contacts into a single vertical header structure, optimizing space on printed circuit boards. This specific model represents a variant optimized for mixed-signal applications requiring robust connectivity.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source data. Verify compatibility with existing board designs and mating connectors before considering alternative components from other manufacturers.
